Issue

Table of Contents Solid State Technology Year 2002 Issue 1	DEPARTMENTS Think Tank Think Tank Celebrates 10 Years! K.H. "Wicks" Wickremasinghe has been writing Think Tank challenges for AP for 10 years now, and we'd like to commemorate the anniversary by telling you about the man behind the puzzles Notes From The Floor Subsidiary evolution There has been a profound shift in paradigm in regard to multinational corporations (MNCs) and their foreign subsidiaries during the past 10 years Industry Voices Moving automation from the front end to the back end Twenty years ago, there was little focus on software and automation in wafer fabrication. The frontiers of science were being pushed back to keep up with Moore's Law and enabling technologies were bound to succeed Product Roundups APEX Preview This year APEX will be held January 20-24, 2002, at the San Diego Convention Center. To help our readers prepare for the show, we're offering a preview of products and technologies that will be exhibited 10supth Supanniversarybr 10^thAnniversary Anniversary Insights Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro- and meso-scale packages, primarily using electronic signals and the logic of programming to interface to the macroscopic world News MicroScale begins bumping services in Korea MicroScale Co. Ltd., Korea's largest chip bumping house, has begun to operate a bumping line for semiconductor chips News IMAPS Workshop Report IMAPS held its third Advanced Technology Workshop on "Packaging of MEMS and Related Micro Integrated Nano Systems" in early November in Scotts Valley, Calif. The Meptec And Advanced The MEPTEC and Advanced Packaging Technologists of the Year Award The Third Annual Microelectronics Packaging Technologist of the Year Award, sponsored by the Microelectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine, was presented in October during a special MEPTEC luncheon News Advancements in acoustic microscopy Builders of high reliability systems that incorporate commercial off-the-shelf (COTS) components can enhance system reliability by using a new type of acoustic microscope system developed by Sonoscan Inc. News Boeing introduces automated MEMS aligner The Boeing Company has engineered a MEMS device and soldering technique that provides rapid and precise alignment of single-mode optical fibers to laser sources, photodetectors and other single-mode optical fibers News JEDEC announces lead-free definition JEDEC has recently approved a definition for lead-free solid state devices, which is "a solid state device that contains no more than 0.2 % by weight of elemental lead (Pb) Editorial Time flies We take great pleasure this year in celebrating the 10th anniversary of Advanced Packaging. Yes, it was way back in 1992 when AP hit the streets

FEATURES Step By Step The back-end process: Step 1 - Package design As semiconductor devices become significantly more complex, designers are challenged to fully harness their computing power Functional Tuning Of Hyb Functional tuning of hybrids Functional laser tuning of traditional ceramic-based hybrid circuits has been accomplished with the use of a standard 1.064-µm wavelength Nd:YAG laser for more than two decades Die Traceability.html Die Traceability Strip packaging and wafer-level packaging (WLP) are now making packaging and final test more like fab processing Cleaning Laser Debris Fr Cleaning laser debris from TAB circuits The formation of carbon residue while UV lasers drill microvias in polyimide or other dielectric materials is normal and expected Next Generation Packagin Next-generation packaging for fiber optics & MEMS Next-generation packaging for fiber optic and MEMS modules will require improved levels of mechanical, thermal and environmental stability combined with increased capability to integrate electrical and optical functions Packaging Of Fiber Colli Packaging of fiber collimators Packaging and assembly still dominate the overall cost of any fiber optic devices,¹ largely because fiber optic alignment and attachment are difficult and time consuming

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