Category Archives: Materials and Equipment

July 9, 2012 — Semiconductor test equipment supplier Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.

The hardware set up comprises a Multitest InStrip3D, a test interface board, and a contacting solution based on vertical spring technology. The system will be used to electrically test partial stacks during assembly of a mobile SoC.

The integrated test solution uses a Multitest load board, which has fine-pitch, high layer count PCBs to support this 0.4mm pitch array application in a high-pin-count multi-site configuration. In close cooperation with the customer, the mechanics of the test were redesigned to accommodate the increased forces from the highly dense pogo array of approximately 6000 pins.

The InStrip3D, part of Multitest

July 8, 2012 — Don’t fill up your exhibit hall meetings list just yet. Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.

More SEMICON West product previews:

Metrology, inspection, and process control products

Lithography products

Semiconductor packaging products

Wafer processing and handling products

Gas distribution equipment and other products

Air Liquide will highlight several product lines at SEMICON West and Intersolar North America, including ALOHA, dedicated to the development, manufacturing, and marketing of advanced precursors for ALD and CVD applications. Other features at the booth will be the company’s SaFlow specialty gas distribution equipment for solar and nanotechnology applications; BBr3 (Boron Tribromide) alternative boron dopant source for solar; Total Gas and Chemical Management services for fabs; Balazs NanoAnalysis clean manufacturing solutions and analytical services for advancing high-technology products through materials characterization and contamination reduction; and the next-generation Flexible Factory Control System (FFCS). Air Liquide, South Hall, Booth 1007.

 

Electrostatic discharge meter

TREK INC. is debuting the Model 511 Hand-Held Field Meter, an economical and reliable way to monitor electrostatic fields for the semiconductor, photovoltaic/solar and electronics manufacturing industries. Model 511 is a portable, chopper-stabilized, non-contacting electrostatic field meter designed for testing and auditing of electrostatic fields. An optional charge plate accessory enables Model 511 to be used for the balancing and testing of ionization blowers and devices. The unit can also be used for surface voltage measurements of photoconductors or dielectric surfaces and for measurement of electrostatic potentials on film, polymers, and paper. The unit has a switch-selectable measurement range of either ±2 kV per inch or ±20 kV per inch. Measurement accuracy is better than 5% of reading. It operates in ionized or non-ionized environments. Additional features include an easy-to-read LED display, a hold-switch that preserves a reading on the display until released, and a push-button ‘auto-zero’ feature that removes any offset voltage. TREK INC., South Hall, Booth 1123.

 

Filtration and purification products for leading-edge fabs

Pall Corporation (NYSE: PLL) will unveil advanced filtration and purification products targeting 22nm and smaller-node semiconductor fabs. The products are used in chemical, gas, photolithography, ultrapure water and CMP applications. The 10nm Ultipleat SP DR G2 filter uses a proprietary, highly asymmetrical membrane to remove particles down to 10nm in size. The larger-diameter G2 filter provides 45% more liquid flow at the same differential pressure as the current standard filter. It can be implemented for critical, ambient, wet chemical surface preparation processes. The all PFA disposable UltiKleen G3 HiT KC assembly will also debut, featuring a Pall Excellar ER filter cartridge with a uniquely modified, 15nm-rated PTFE membrane that remains wet in critical aqueous chemicals. The UltiKleen G3 HiT KC Assembly’s design improves fluid dynamics and enables efficient removal under new, higher-temperature SPM processes. The new filter has been shown to reduce sub 20-nm particles by more than 25% in 120°C sulfuric acid filtration compared to previous designs. Pall will showcase the new Profile Nano filter developed to classify both ceria and low solids colloidal silica slurries typically used in advanced CMP processes, such as shallow trench isolation (STI) and barrier copper. The Profile Nano filter contains extremely fine fibers that improve particle removal efficiency to better than 99% at 200nm. Pall will introduce the IonKleen CAF purifier/ filter for critical point-of-use applications in ultrapure water. It can reduce trace metal ions to < 1 part per trillion (ppt) at challenge levels up to 10 ppb and water flow rates up to 20 liters per minute. In addition to the active polyethylene membrane, the large area, G2 style cartridge contains a highly efficient filter for removing 10nm and greater particles. Pall Corporation (NYSE: PLL), South Hall, Booth 1519.

 

Filtration for advanced patterning processes

Pall will introduce two products for advanced patterning applications: the 2nm PE-Kleen filter with an extremely tight membrane to prevent defects in 14nm semiconductor patterning, and the Nylon Extension filter designed to increase photoresist contact time within the nylon 6,6 membrane. The 2nm PE-Kleen filter is constructed of ultra-high-purity, high-density polyethylene. The Nylon Extension filter increases contact time to enhance nylon 6,6 adsorption. The removal of insoluble polymer components by adsorption helps reduce bridge type defects. The new 2nm PE-Kleen and Nylon Extension filters are available in several different cartridge and capsule configurations, including the quick-disconnect PhotoKleen EZD-3X assembly. Pall Corporation (NYSE: PLL), South Hall, Booth 1519.

 

Gas purification and filtration products

Pall will also uncrate products for use in ultra-high-purity gas applications. The Gaskleen II EL purifier is a compact purifier assembly suitable for intermittent process flow rates up to 50 standard liters per minutes (slpm). The assembly can be filled with any of Pall’s AresKleen purification materials to remove molecular contaminants such as moisture, oxygen, carbon dioxide and hydrocarbons to levels below 1 part per billion (ppb) from process gases. The purifier also contains an integral filter that removes particles ≥3nm with a >9 log efficiency. ChamberKleen diffusers will launch with NW40 and NW50 flanges for venting of load lock or other vacuum chambers where large volumes of gas need to flow in a short time. The assembly contains a high-flow filter pack capable of removing particles ≥3nm in size. It operates at differential pressures of up to 0.72 MPa (105 psid) to enable higher inlet pressures and faster chamber filling times. Pall Corporation (NYSE: PLL), South Hall, Booth 1519.

 

Wafer handling

CHAD Industries will demonstrate automated wafer handling of electrostatic wafers carriers with automated SMIF pod delivery, exhibiting the WaferMate300-2 wafer handling workcell running WaferWare software. The workcell will be configured with both a 300mm FOUP loadport and 200mm SMIF-EZ loadport. It can automate handling of standard and nonstandard wafers. The SMIF-EZ loadport will be populated with 200mm electrostatic carrier wafers from CHAD’s Technology partner Beam Services. The carriers will have a smaller-diameter wafer mounted to them to demonstrate standard wafer handling of a challenging size. CHAD will also be demonstrating Adept Technology’s autonomous indoor vehicle (AIV) for automated SMIF pod delivery. The transporter is a safe autonomous indoor vehicle for delivering 200mm, 150mm, and reticle SMIF Pods within semiconductor fabs with no additional infrastructure required. It reduces vibration and handling in wafer delivery. CHAD Industries, North Hall, Booth 6274.

 

Jetting system and new cartridge

Nordson ASYMTEK will demonstrate its new NexJet jetting system with the one-piece Genius Jet Cartridge. As simple as an ink jet printer cartridge, Genius is easily removed and replaced in seconds without tools. The Genius Jet Cartridge dispenses up to 50 million cycles before a replacement is necessary, with memory to store and communicate usage data. This intelligence enables quality dispensing and high yields. The advanced design of the NexJet system includes new software that widens the process window to ensure stable and repeatable results for high-yield production and broadens the range of jettable fluids and applications. The NexJet System includes new precision software control of the jetting process, enabling successful results with both low- and high-viscosity fluids, and accommodates a broad range of fluids for applications such as flip chip underfill, chip scale package, ball grid array, package-on-package underfill, precise coating, and adhesive dispensing. Each NexJet System ships with two Genius Jet Cartridges and a specially designed Genius Jet Cartridge Cleaning Tool. The NexJet system is available as an upgrade for Nordson ASYMTEK’s Spectrum, Axiom, and DispenseMate Series platforms, and can accommodate six reservoir sizes: 3cc, 5cc, 10cc, 30cc, 2.5 oz, and 6 oz. The Genius Jet Cartridge comes in 4 sizes. Nordson ASYMTEK, North Hall, Booth 6071.

 

Printing tool & epoxy

Optomec will demonstrate several devices with 3D printed electronics fabricated with its Aerosol Jet tool: an automotive tank with fill level sensor and control circuitry (courtesy of Neotech Services MTP); a multi-chip package (MCP) with fine line conformal interconnects; and aircraft components with printed antennae, sensors, and power distribution circuitry. Optomec will also showcase a new conductive epoxy developed by Resin Design specifically for use with the Aerosol Jet printing process and its fine-feature capabilities. Together, this novel material and the Aerosol Jet system can be used to produce high-conductivity adhesive features for surface mount and high-stress interconnect applications. Aerosol Jet technology can print a wide variety of electronic materials directly onto a wide variety on non-planar surfaces. The tool produces a high-velocity material mist stream, printing interconnects for vertically stacked dies, without adjustment to Z-height positioning. The system can print fine features to <10µm and wide features >1cm. Multiple print heads can be independently controlled by the Aerosol Jet system and each print head can have multiple nozzles providing a high degree of system scalability to meet application throughput requirements. Optomec, North Hall, Booth 6665.

 

Active piezoelectric vibration cancellation system

TMC’s STACIS 2100 active piezoelectric vibration cancellation system is the industry standard solution for the most sensitive instruments in noisy environments. Primarily designed to isolate precision microlithography, metrology, and inspection equipment in advanced semiconductor factories, STACIS is hundreds of times stiffer than air isolators and suffers from none of their limitations. There is no soft suspension and, unlike active air systems, STACIS can be “stacked” (placed beneath a tool with an internal active air isolation system). STACIS employs advanced inertial vibration sensors and piezoelectric actuators to cancel vibration by sensing floor vibration, then expanding and contracting the actuators to filter out floor motion. With STACIS, precision tools can be located in noisy environments and still meet the tool manufacturer’s floor vibration criteria. TMC, a unit of AMETEK Ultra Precision Technologies, South Hall, Booth 2122.

Check out Solid State Technology’s coverage of SEMICON West 2012!

July 4, 2012 — EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company’s new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and through silicon via (TSV) manufacturing.

"Temporary bonding and debonding of device wafers to wafer carriers for thin-wafer processing are critical steps to enabling the successful integration and implementation of 3D ICs into high-volume production," stated Dr. Thorsten Matthias, Business Development Director, EV Group.

A combination of hardware and software design enhancements enables double the processing throughput over EVG’s previous-generation platform, to up to 40 stacks per hour. The EVG850TB/DB accommodates up to 9 process modules, doubling the previous maximum processing capability of EVG’s temporary bonding and debonding systems. The new XT Frame-configured EVG850TB/DB is designed for EV Group’s open materials platform approach, which enables the use of a wide range of adhesives from various materials suppliers, including ZoneBOND.

The new XT Frame design enables highly efficient continuous mode operation (zero idle time) capability via an ultra-fast handling system, up to four front opening unified pod (FOUP) load ports, and a material buffer in the form of a local FOUP storage system that holds up to 10 additional FOUPs.  The platform also features an in-line metrology module option to enable real-time monitoring of the bonding/debonding process-enabling maximum yields and helping to lower production costs for thin-wafer processing.

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

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July 3, 2012 – BUSINESS WIRE — Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO), which makes laser-based tools for microelectronics manufacturing, received multiple-unit orders for its model 3510 test system from leading Japanese and Korean electronic components manufacturers.

The customers are expanding production of small-geometry multi-layer ceramic capacitors (MLCCs), which are integrated into smartphones by the hundreds. The devices are small form factor (size 0603 and 0402) with metalized terminals.

The ESI 3510 performs electrical testing with a rotary technology that supports multiple tests simultaneously. The system offers high-throughput small device handling with reliable sorting capability. It can test and sort up to 840,000 MLCC chips per hour. Precision-controlled dynamic contact force eliminates marking on the MLCC

July 2, 2012 — Seiko Epson Corporation (TSE: 6724) launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors in downstream processes.

The IC test handler transfers finished semiconductors to inspection equipment for electrical, visual and other final performance tests, then sorts them by good/defective or other parameters. It transfers, inspects, and sorts up to 20,000 ICs per hour.

With the ability to transfer 32 semiconductors to inspection equipment at a time, this new model offers twice the capacity of Epson’s previous top model, the NS-8160W. Epson also uses its original Smart Motion Control robot control technology to enable fast movement while maintaining low vibration when transferring semiconductors. In addition, the plate can be heated to enable testing at extreme temperatures of up to 155

June 29, 2012 – BUSINESS WIRE — Semiconductor fab tool supplier Ultratech Inc. (Nasdaq:UTEK) acquired the rights to a collection of patents from semiconductor leader IBM. Ultratech gained semiconductor packaging technologies including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging IP.

Representing both U.S. and foreign patents, the portfolio includes claims directed at methods of making, at compositions and at structures of semiconductor devices. This acquisition strengthens and broadens Ultratech’s offerings to facilitate advanced packaging at the lower device nodes.

Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Visit Ultratech online at: www.ultratech.com.

IBM makes semiconductors and other microelectronics. For more information on IBM, please visit:www.ibm.com

June 28, 2012 — Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 at the Moscone Center in San Francisco, CA.

More previews:

Wafer fab and handling products

Packaging products

450mm WaferSense auto vibration system

CyberOptics Semiconductor added a 450mm form factor to its WaferSense Auto Vibration System family. Users put the wireless, wafer-like product through semiconductor fabrication processes to measure vibrations of wafer transfers in x, y and z dimensions. It can be used to observe and optimize wafer, cassette, SMIF and FOUP motions without exposing process areas to the environment. The data helps establish yield-based vibration standards for equipment, identify vibration sources, and set acceptable acceleration parameters for equipment. Companion vibration monitoring software allows engineers to set  low, high, and band pass filters of equipment vibration frequencies to troubleshoot for vibration-related contamination. The software allows engineers to collect and display acceleration data wirelessly to see the effects of adjustments in real-time. CyberOptics Semiconductor, South Hall, Booth 2406.

Low-cost cryogenic probe station

Lake Shore Cryotronics Inc. will feature its range of cryogenic and cryogenic-free probe stations. The Model TTPX cryogenic probe station is a lower-cost cryogenic micro-manipulated probe station, used for non-destructive testing of devices on full and partial wafers up to 51mm (2”) in diameter. The TTPX measures electrical, electro-optical, parametric, high Z, DC, RF, and microwave properties of materials and test devices. A wide selection of probes, cables, sample holders, and options enable customization for specific measurement applications. Other models are available to meet a variety of parameters, including magnet field, maximum number of probe arms, standard temperature range, high and low temperature options, maximum sample size, vacuum, and sample stage rotation. Lake Shore will also be highlighting the new lower-cost cryogen-free probe station, the Model CRX-6.5K. Lake Shore Cryotronics Inc., Booth 6458.

Hall effect measurement system

Lake Shore’s new 8400 Series Hall Effect Measurement System (HMS) uses AC Hall effect measurement to support researchers exploring the electronic and magneto-transport properties of low mobility electronic materials. The 8400 Series can measure Hall mobilities down to 10-3cm2/Vs, suiting solar cell, organic electronics, transparent conducting oxides, III-V and III-VI semiconductors, magnetoresistors, and other materials. Lake Shore Cryotronics Inc., Booth 6458.

X-Ray diffractometer and reflectometer

Jordan Valley’s Delta-X is a new-generation flexible X-ray diffraction instrument for materials research, process development, and quality control. Featuring fully automated source and detector optics with a horizontal sample mounting, the system can switch between standard and high resolution X-ray diffraction, and X-ray reflectivity modes under full computer/recipe control without the need to manually change configurations. Measurements can be run partially or fully automated, with user-customizable scripts handling the routine work. It is also possible to run the tool in a completely manual mode, to enable the development of new methods or to investigate new materials. Analysis of the data can be fully automated as part of the measurement routine, or analyzed off-line if required. Using RADS and REFS in automated mode, developed for semiconductor manufacturing lines, allows routine analysis to be performed and reported without any user intervention. RADS and REFS can also be installed off-line to allow more detailed analysis. It features high-precision sample positioning and scanning with 300mm Eulerian cradle and full 300mm wafer horizontal mounting and mapping. Pole figures and residual stress measurements are possible due to 100° tilt (Chi) and unlimited azimuthal rotation (Phi). Jordan Valley Semiconductors Ltd., Booth 2141.

Transmission X-ray topography system

The JV QC-TT is a dedicated quality control tool for non-destructive detection of crystalline defects in semiconductor wafers. It inspects Si, GaAs, InP, Sapphire, SiC and other substrates up to 300mm wafers. The tool supports dual resolution for fast detection and detailed examination of defects. Defects include edge defects, fault lines, slip lines, point detects, and embedded defects. Full wafer scan or selected areas scans are possible. X-ray topography can also be used to detect the first “known good wafer” in the ingot. The QC-TT eliminates the “defect-etching” process and the use of hazardous etching chemicals, with faster throughput. The JV-SIA software suite supports reporting on defects and creating defect maps and lists. Jordan Valley Semiconductors Ltd., Booth 2141.

In-line 450mm X-Ray imaging system

The JV SENSUS 450mm/300mm in-line system detects crystalline non-visual defects (NVD) such as edge defects, fault line & slip lines within substrate or product wafers using Transmission X-Ray diffraction. The product solves key issues in the use of expansive 450mm wafers in manufacturing environment, where the thermal stresses on larger wafer are much higher and the wafers are subjected to many more handling steps. Metrology can cover fast selected region or full wafer scan options. Cracks observed in the X-ray images can help determine if the wafer will break during annealing. It can also be used to search for the first “known good wafer” in the ingot. A slice is taken from the ingot and a measurement performed on the JVSenus. The absence of slip and other defects indicates the good region of ingot which can be used. The tool uses JV-SIA software. Jordan Valley Semiconductors Ltd., Booth 2141.

Super-resolution digital microscope

KEYENCE’s VHX Series Digital Microscope integrates advanced zoom optics with a CCD camera and 17” display, light source, controller, and analysis/reporting software. It offers a magnification range from 0.1x – 5000x. Many lighting techniques are also supported including bright and dark field, transmitted, polarized, and differential interference observation. A color filter wheel allows users to choose a specific wavelength (red, green or blue) of light for their samples. A Super Resolution mode combines the blue filter with KEYENCE’s pixel shift technology, capturing images with 25% better resolution. The VHX-2000 can be equipped with a motorized XY stage along with motorized Z-axis lens control. Users can adjust movement in all three axes by using an included control pad. The Image Stitching function can now be completed with just the push of a button, and at much higher speeds, to produce up to a 20,000 x 20,000 pixel image that expands the viewing area by up to 200 times. Automated measurement functions simplify measurement tasks and help to remove variation between different users. The system also has the ability to save a portion of the image/measurements as a template to be used to measure future samples. KEYENCE, Booth 6651.

3D laser scanning microscope

The new KEYENCE VK-X Series 3D Laser Scanning Microscopes combine the capabilities of SEMs and non-contact roughness gauges with the simplicity of an optical microscope. It boasts 0.5nm Z-axis resolution with a magnification range spanning 200x to 24,000x. Usability and ease-of-use have been improved with the addition of the AI-Scan function, allowing users to easily image and measure a target. A short-wavelength laser scans across a target to provide non-contact profile, roughness and thickness measurements, even on targets with highly-angular surfaces.  By combining the laser with an industry-leading, 16-bit photomultiplier, the VK-X can obtain an image and measurement on nearly any type of material, as well as thickness measurements on transparent films and coatings. In order to simplify the operation of the VK-X, the AI-Scan function was developed to automate the scanning process.  Users can simply place their sample on the stage, and by clicking a single button, the system will automatically adjust the sensitivity of the photomultiplier, set the upper and lower limits of the scan range and re-scan the target as needed to make sure all of the necessary information was captured.  By using this function, even inexperienced users can quickly and easily obtain accurate measurement data and high-resolution images. Additional features include a new WIDE-Scan function that is 8x faster than conventional laser scanning microscopes, while also improving the quality of the captured image.  A high-speed auto-focus algorithm has been incorporated into the system, and images can be captured at up to 21.6 megapixels.  All of the measurement functions from our previous VK Series product line have been extended to the VK-X, including the ability to measure the thickness or profile/roughness of transparent materials. KEYENCE, Booth 6651.

RoHS, WEEE & REACH testing & certification

Manufacturers of electrical and electronic equipment who export to the European Union must comply with the REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals), WEEE (Waste of Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances) Directives, or risk losing access to market. TÜV Rheinland provides consulting, testing and labeling services for manufacturers and importers on all matters to do with the requirements of these directives to help companies gain European approvals. TÜV Rheinland, Booth 1825.

Top-load burn-in socket

Aries Electronics is introducing a top-load burn-in socket for new IC pin-out designs. It is delivered in 4 weeks at about $200 tooling costs, compared to other options that take up to three months and run over $30,000. Based on a modular design, the new socket can easily be configured to accommodate devices on 0.3mm-pitch and above, and can be used with BGA, µBGA, QFN, LGA and bare dies as well as a number of other devices like those used for MEMS testing with high acceleration rates. The top load socket helps reduce device damage for equipment under test (EUT) by minimizing several points of over-compression and errors in device insertion.  Devices are loaded and unloaded on the top of the socket without compressing the socket or holding it down.  When engaged, the socket also avoids over-compression with pressure pads that cover a larger surface area to distribute force on the device. A built-in hard stop also reduces insertion force on the PCB. The socket comes in a top load configuration, ready for device insertion, so no special tooling or push plates are required. The manual dual latches can be removed to allow the socket to open when the force is removed for efficient and quick testing of multiple devices. They are mounted and removed from the test board via 2 stainless steel alignment pins. The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability. Compression spring probes are constructed of heat-treated beryllium-copper, and plated with a minimum of 30 micro inches gold per MIL-G-45204 over a minimum of 30 micro inches nickel per SAE-AMS-QQ-N-290. Contact forces are 15g/contact on a 0.30mm to <0.40mm pitch; 16g/contact on a 0.40mm to <0.50mm pitch and 25g/contact on pitches of 0.50mm or larger.  Estimated contact life is a minimum of 500,000 cycles and operating temperature is -55° to +150°C. Aries Electronics Inc., North Hall, Booth 6063.

 

“Smart” spectrometer

The Exemplar from B&W Tek is a miniature spectrometer with an embedded processor to enable on-board data processing, including averaging, smoothing, and automatic dark subtraction. In addition to these “smart” capabilities embedded directly into its compact form factor, the Exemplar also features “SuperSpeed” USB 3.0 communication with a data transfer of 900 spectra per second. Multichannel capabilities deliver an ultra-low trigger delay of 14 nanoseconds and a gate jitter of +/-1 nanosecond. The ability to control the CCD exposure time to within one microsecond allows users to have unparalleled control over the spectra’s signal-to-noise ratio. It is ideal for demanding applications such as high speed binning & sorting, reaction kinetics, and process monitoring. With the ability to support up to 16 simultaneous channels, the Exemplar is also the perfect solution for simultaneous multichannel analysis, such as multipoint sampling, and laser induced breakdown spectroscopy (LIBS). B&W Tek, Booth 2241.

Bond test tool

The Nordson DAGE 4000Plus Bondtester meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting. Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), North Hall, Booth 5971.

X-ray inspection system

The Nordson DAGE XD7600NT Diamond X-ray Inspection System features the Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1 µm  feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector makes this system the choice for the highest performance and highest magnification imaging tasks. The vertical system configuration, with the X-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications. Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), North Hall, Booth 5971.

Watch the Solid State Technology website for many more product previews of SEMICON West.

Visit the Semiconductors Channel of Solid State Technology!

June 28, 2012 — Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain. Held in conjunction with SEMICON West, the largest and most influential microelectronics exposition in North America, the Best of West finalists have been selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.

The 2012 Best of West Finalists are:

  • The QC‐TT defect inspection system from Jordan Valley Semiconductor UK Ltd. solves key issues in the use of 450mm wafers in a manufacturing environment, where wafers are subjected to more handling steps and the thermal stresses on larger wafers are much higher. This makes the wafers more prone to breakage, which can be predicted using the QC‐TT. The system can also identify the slip and other crystalline defects in wafers, which may not have catastrophic effects on the substrate integrity but will contribute to a reduction in yield.
  • The NSR‐S320F Dry ArF 193 nm scanner from Nikon Precision, Inc. is based on the company’s Streamlign platform, to satisfy the demanding non‐immersion overlay accuracy, stability, and ultra‐high productivity requirements essential to cost‐effective 22 nm applications and beyond. The Streamlign platform, which was first employed on immersion scanners, provides industry‐leading overlay accuracy ≤ 3 nm with throughput ≥ 200 wafers per hour (WPH).
  • X-Plane Analysis from Nordson DAGE is an option for the company’s DAGE range of X-ray inspection systems. It uses a tomosynthesis technique to create 2-D X-ray slices in any plane of a semiconductor device or printed circuit board assembly. The user can get a very high level of detailed information about potential failures without the need to destroy the sample,  usually necessary with traditional CT systems.

The selection of finalists was made by a prestigious panel of judges representing a broad spectrum of the microelectronics industry.

The Best of West Award winner will be announced during SEMICON West on Wednesday, July 11, 2012 at 1:00pm.

About SEMI

SEMI is the global industry association serving the nano- and microelectronic manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org. 

About PennWell

PennWell Corporation is a diversified business-to-business media and information company that provides quality content and integrated marketing solutions for the following industries: Oil and gas, electric power, water and wastewater, renewable, electronics, semiconductor, contamination control, optoelectronics, fiberoptics, enterprise storage, converting, nanotechnology, fire, emergency services and dental. Founded in 1910, PennWell publishes over 120 print and online magazines and newsletters, conducts 60 conferences and exhibitions on six continents, and has an extensive offering of books, maps, web sites, research and database services. In addition to PennWell’s headquarters in Tulsa, Oklahoma the Company has major offices in Nashua, New Hampshire; Houston, Texas; London, England; Mountain View, California; Fairlawn, New Jersey, Moscow, Russia, and Hong Kong, China.

June 26, 2012 — JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.

The lasers machine glass, ceramics, metals and alloys, and other hard-to-process materials. With ultrafast laser processing, the pulse duration is shorter than the thermal diffusion timescale of the material, resulting in a direct solid to vapor transition that greatly reduces debris formation, and minimizes thermal impact on the surrounding area.

The JPSA picosecond laser platform is designed to accept multiple types of ultrafast lasers. Laser choices include infrared (IR), green or UV wavelengths, and a range of power and pulse rate options. The laser is accommodated in a slide-out service trolley within the workstation, and is fully integrated with the system control software. 

JPSA provides a dual-beam delivery configuration; a fixed-beam configuration can be used to produce a finely focused beam, with a precision air-bearing stage for precise feature positioning; for high-speed processing of complex shapes, a high-accuracy galvanometer configuration incorporates a step-and-scan function. The IX-6168-PS is delivered with both fixed beam and galvanometer scanning capability, and can be easily reconfigured on-site to suit individual needs.

The IX-6168-PS can be supplied as a manual-load system, or combined with JPSA’s Integrated Automation Platform for fully automated operation in semiconductor wafer applications. Configuration options include laser wavelength, power and repetition rate, and a choice of galvanometer scanner and lens systems to optimize large deflection field applications.

JPSA products and services include UV excimer, DPSS and ultra-fast laser micromachining systems, UV and VUV laser beam delivery systems, laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA operates a high-performance laser job shop as well as a systems engineering and manufacturing business. For more information, visit http://www.jpsalaser.com.

June 25, 2012 – BUSINESS WIRE — Materials supplier Dow Corning will collaborate with semiconductor processing tool supplier SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process. Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods and provides compatibility with thermal and chemical requirements for via-middle and interposer TSV processing, as well as faster room-temperature de-bonding required for advanced packaging applications.

Also read: Imec’s via-middle TSV fab ‘reveals’

Dow Corning provides performance-enhancing silicones and silicon-based technology and innovation. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. Learn more at dowcorning.com.

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