Category Archives: Metrology

April 19, 2005 – Sematech has announced its top technical challenges for 2006, continuing to underscore advanced gate stack, 193nm immersion and EUV lithography, mask infrastructure, and low-k dielectrics with process compatibility. Consortium leaders also placed planar bulk transistor scaling on the list for the first time.

Sematech uses the top challenges to focus its resources on the most critical of ~75 projects that it maintains in key areas of semiconductor and related R&D. The Sematech research portfolio is developed by the consortium’s Executive Steering Council (ESC), in consultation with corporate managers.

“Sematech continues to remain at the forefront of semiconductor R&D, and this set of challenges reflects our commitment to that goal,” said Michael R. Polcari, Sematech president and CEO. “This list also reflects the guidance of our member companies on how to best use our skills and resources to benefit Sematech’s members and the industry. We’ll address many of these issues in collaboration with our R&D partners, including the university researchers investigating promising semiconductor technologies in our Texas-based Advanced Materials Research Center [AMRC].”

The Sematech challenges reflect the consensus of the consortium’s member companies, and are grouped below by technical area:

Lithography: immersion lithography, mask infrastructure, resist strategy, and EUV infrastructure

Frontend Processes: advanced gate stack, nonclassical CMOS, and planar-bulk transistor scaling

Interconnect: low-k dielectrics and process compatibility

Manufacturing: metrology, and manufacturing effectiveness and productivity

Environment, safety, and health

April 15, 2005 — Nanometrics Inc. (Nasdaq:NANO), a supplier of metrology equipment, named Quentin Wright to the newly created position of chief accounting officer, reporting to President and CEO John Heaton.

Wright will be primarily responsible for managing Nanometrics’ compliance processes, including compliance with Section 404 of the Sarbanes-Oxley Act, according to a news release, and his long-term responsibilities will be to help ensure Nanometrics maintains effective financial accounting mechanisms. He will work alongside CFO Paul Nolan.

Prior to joining Nanometrics, Wright held the post of director of accounting for Adaptec Inc. Before Adaptec, Wright was the corporate controller for Vascular Therapeutics Inc. He has also held controller posts with ALZA Corp. and Micrographic Technology Corp.

April 12, 2005 — Nanometrics Inc., a supplier of metrology equipment for the semiconductor industry, named Michael Weber to the newly created position of vice president of engineering.

Weber will manage the company’s engineering and product development programs in Milpitas, Calif., and report to President and CEO John Heaton. Previously, Weber was the vice president of KLA-Tencor’s Surface Metrology division, where he was responsible for technology and product strategy programs.

April 4, 2005 – Nikon Instruments Inc. has announced the integration of two high precision industrial metrology business units, Semiconductor Inspection, and Nexiv Vision Measuring Systems, under the SITECH Division located in Tempe, AZ. Two new departments have been established within the division: Vision Systems and Semiconductor Inspection.

This purpose of this move by Nikon is to improve customer responsiveness by building on the synergies of these high tech teams, and by coordinating their applications engineering and service departments, product management and sales teams, improve efficiency, and prepare Nikon for significant new business opportunities in Nikon’s precision measurement and inspection product roadmap.

The new SITECH Division will be lead by Takeshi Kamiya, general manager who reports to Lee Shuett, executive VP, Nikon Instruments Inc. Shuett reports to Fumitaka Akeda, president, Nikon Instruments.

“This important change will enable these two businesses to share the outstanding facilities at our Tempe office, and by combining our resources, personnel and facilities, position Nikon for broader growth within the semiconductor and vision systems measuring vertical business,” said Mr. Shuett.

Advances in metrology tools combat nanometer contamination

When measuring semiconductor features, recent industry developments illustrate that the linkage between metrology and contamination control is getting tighter as features shrink.

Therma-Wave Inc. (Fremont, Calif.; www.therma-wave.com) has rolled out a thin-film and critical dimension metrology tool that features an improved, built-in version of the company’s molecular contamination cleaning system. This desorption unit removes the airborne molecular contamination build-up on wafers so that thin-film measurements can be made.

KLA-Tencor Corp. (San Jose, Calif.; www.kla-tencor.com) also includes a desorption module in its optical thin-film measurement products. According to KLA-Tencor staff technologist Arun Srivatsa, “This is used to clean and measure selectively on metrology targets on scribe lines.” He adds that the technique, which involves heating up a small area on the wafer so that organics boil off, is of most value when measuring the gate oxides and other ultrathin films for 65-nanometer (nm) and below processes.

These thin films are less than 50 angstroms (Å)-or 5 nm-thick. Studies by KLA-Tencor have revealed that the build-up of airborne molecular contaminants can exceed 0.5 Å within two hours after a gate oxide is grown. That’s large enough to throw off optical measurements of the thin film by more than the few tenths of an angstrom that the measurement tools have in their error budget.


An extreme magnification of a Xidex Corp. carbon nanotube (fine line) grown atop a larger silicon tip structure used in a scanning probe microscope. Such surface sensors are seen as providing important measurement capability for producing advanced semiconductors, where contamination control issues will become increasingly crucial. (Source: Xidex Corp.)
Click here to enlarge image

So, metrology companies must introduce point-of-use cleaning for contamination control. Only by removing contaminants just prior to measurement can the tools ensure accurate results.

Recently, Xidex Corp. (Austin, Texas; www.xidex.com) revealed that its carbon nanotubes would be used in semiconductor metrology tools. The industry wants to use carbon nanotubes to form the tips of scanning probe microscopes. These tips act like a microstylus, tracing out molecular-sized features. Scanning probe microscopes, which are also known as atomic force microscopes, can profile deep vias, high aspect ratio trenches and critical dimensions in advanced semiconductor processes (like the upcoming 32-nm process node).

The research consortium SEMATECH (Austin, Texas; www.sematech.org), which is interested in carbon nanotubes because of their characteristics, is working with Xidex in developing its technology. Nanotubes, unlike other materials, are very resistant to wear and can be made with diameters that measure in nanometers. That radius of curvature is tighter and the resulting tips smaller than are possible with other materials.

Even though carbon nanotube tools have yet to be deployed, scanning probe microscopes face measurement challenges that are contamination-driven. The Xidex solution involves the use of what’s known as tapping mode. “The tip only momentarily contacts the surface,” says Paul McClure, president and CEO of Xidex. “It drives itself in and out of any surface layers so quickly that they have no effect.”

At present, the tips are not made in a cleanroom but that may change as production ramps up. “A cleanroom will be required to increase yield and to protect the tips prior to packaging,” predicts John Allgair, project manager for lithography metrology at SEMATECH. III

Xradia names Diamond CEO


March 23, 2005

Mar. 23, 2005 — Xradia Inc., a developer and manufacturer of x-ray imaging systems for 3D tomography and nanotechnology applications, announced that Bill Diamond will join the company as chief executive officer.

Diamond’s career has included roles in manufacturing operations, sales, marketing and general management at Lucent Technologies, E-Tek Dynamics, Lasertron, DenseLight Semiconductors and Wavesplitter Technologies, according to a company news release. He was CEO of DenseLight and Wavesplitter and, most recently, was President of Neptec Optical Solutions.

Xradia is a privately held company established in 2000 to commercialize high-resolution x-ray microscopes for nondestructive inspection and nano-scale imaging. Initially targeted at failure analysis in the IC industry, the company has subsequently developed a suite of commercial x-ray imaging products for metrology in semiconductor IC production, scientific equipment, biomedical research and nanotechnology development.

Mar. 18, 2005 — Veeco Instruments Inc. announced that it received an order for its Dimension X3D automated atomic force microscope from a leading global hard disk drive manufacturer.

The tool, which will be used to measure critical dimensions on next-generation thin film head perpendicular pole structures, is currently scheduled to ship at the end of the second quarter and complements other Veeco process equipment and metrology products installed at the customer’s site.

March 17, 2005 – Therma-Wave Inc. has announced that a leading Taiwanese DRAM semiconductor manufacturer has selected multiple Therma-Wave metrology solutions for use in its 300mm factory. The multimillion dollar order includes multiple Opti-Probe 7341 thin film metrology tools with real-time, critical-dimension capability for use in 90nm technology node production, extendible to 65nm development work. The order also includes a Therma-Probe 630XP tool for ion implant metrology.

Therma-Wave Opti-Probe tools will be used for thickness and CD measurements in both front and back-end metrology applications throughout the customer’s fab. Opti-Probe will be used to measure thin films applied by CVD and removed by plasma etching.

Engineers, lab planners and scientists developed unique lab layouts with groundbreaking temperature and vibration controls

By Dan Hahn, HDR Architecture

In the world of nanoscience, as the size of the material for evaluation diminishes, the challenge to control ambient conditions increases. Therefore, you can imagine the tightly controlled environmental conditions required at the metrology laboratory at the National Institute of Standards and Technology (NIST), where the seismic fountain clock measures time accurate to one second over the life of the entire universe.

To meet these requirements, engineers, lab planners and scientists developed lab layouts with temperature and vibration control not found anywhere else.

Vibration criteria

The vibration criteria for NIST is stated as four vibration amplitude functions given in terms of frequency. Numbers are represented in a vibration curve, in descending order from an extremely quiet standard to that of typical construction.

Criterion Type A1: Velocity amplitude of 3 micrometers/sec or 125 microinches/sec at frequencies below 4 Hz; velocity amplitude of .75 micrometers/sec or 30 microinches/sec at frequencies between 4 Hz and 100 Hz. These criteria could only be achieved with engineered vibration isolation slabs.

Criterion Type A: Velocity amplitude of .025 micrometer or 1 microinch at frequencies between 1 and 20 Hz; velocity amplitude of 125 microinches/sec at frequencies between 20 Hz and 100 Hz. Site studies showed these limits were achievable at grade with slab-on-grade design and special vibration detailing.

Criterion Type B: Velocity amplitude of 6 micrometers/sec or 250 microinches/sec at frequencies between 1 Hz and 100 Hz.

Criterion Type C1: Velocity amplitude of 12.5 micrometers/sec or 500 microinches/sec at frequencies between 4 and 100 Hz. Criteria B and C1 were achievable in conventional building frame design with a consideration given to frame stiffness and mass.

Designing accordingly

At NIST, as with any lab, different portions of the building were programmed with different uses, each required different levels of vibration control. General-purpose labs and a cleanroom had more conventional requirements, while areas of the metrology lab required the A1 criterion mentioned above.

Ambient conditions produce vibration-these run the gamut from drinking fountains and vending machines to air compressors and air handling units. Paradoxically, while the stringent environmental demands of a state-of-the-art lab require proximity of mechanical systems to produce close-tolerance environmental control, these systems are vibration inducing. To meet the NIST metrology lab’s requirement of maintaining temperature to +/- .01˚C, the vast quantities of air-handling equipment needed special attention paid to control of vibration through design. More importantly, to achieve these incredibly precise vibration controls, designers placed the NIST metrology wings underground with no superstructure directly above it, only two to three feet of soil and open area. Because wind does no blow directly upon the shell of the structure, the dynamic forces that could excite the building shell are reduced or even eliminated.

To further reduce vibration, and to allow for the exceptional quantity of ductwork required, the metrology floor was moved to a greater depth, reducing the amplitude of surface waves that naturally decrease with depth. Collaborating with scientists, and based on the prototype studies, engineers also placed giant masses of concrete in pits on air springs under the lab floors. It was found that data measured on the prototype T-shaped concrete slab showed that A1 criterion can be met on the mass in the pit when isolated with air springs down to 1.5 Hz, the lower frequency limit of the measurements.

A walk-on floor isolated from the pit and the mass where experiments take place allows for the experiment to be isolated from the vibrations introduced by the researcher himself (see Fig. 1). Study of the prototype led to a separate support system to isolate each component of the lab floor, pit and mass.


Figure 1. Design of the isolation slab included a walk-on floor, allowing the experiment to be isolated from researcher-induced vibrations.
Click here to enlarge image

Certainly, the most stringent of vibration controls is achieved only through layer upon layer of isolation techniques. For example, the mechanical air handling equipment is isolated internally within the unit using mechanical isolation devices. Isolators are also located within ductwork and supports. Then, equipment is isolated externally. The lab floor is further isolated from surrounding structural elements by vibration isolation joints.

Additional vibration control was studied for potential future use. Active control systems that would read vibration input and adjust spring response to eliminate the vibration input before it travels to the supported mass was evaluated. Variation in the design of the mass was also evaluated for potential improved response.

These controls are moving researchers and engineers into the realm of the experimental, forging virgin ground that can only be determined by meticulous testing and trial and error.

A final word

Lab designers need to fit the vibration control needed to the type of experiments being conducted. It can be a costly mistake to “over design” a lab. The best and most cost-efficient lab is one that is designed “dead on”; one in which the planners fully identify and understand the needs-and constraints-of the researcher.

When construction is completed on the NIST labs, they will contain a range of about a dozen concrete slab masses of various weights and heights, some 100,000 pounds and 3 meters tall, and others 10,000 pounds and 1 meter tall. All meet A1 criterion but vary to accommodate the size of an experiment. Other spaces in the lab will simply provide the conventional slab-on-grade construction, fitting the design to the use. All the vibration features of the NIST AML add to the flexibility, reliability, and redundancy of the whole facility.

In the end, understanding vibration from the source to the experiment led to the right choices. The best-designed lab is simply one that performs as intended. And, in this case, the quietest lab is the one that makes the most impact. III

Dan Hahn, senior vice president with HDR in Omaha, Neb., is the lead structural engineer on the NIST project.

Accent launches new tool


February 21, 2005

Feb. 21, 2005 — Accent Optical Technologies, a supplier of lattice engineering and photolithography process control tools, announced a new 200mm overlay tool, the Q240AT.

The tool is designed to incorporate the productivity and advanced measurement technology of the Caliper elan 300mm overlay tool, providing an overlay metrology solution for 200mm fabs looking to adopt advanced processes.

The company says it provides measurement capability targeting production processes down to 65nm by the adoption of new optics, imaging hardware, focus system and measurement algorithms.