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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
Fraunhofer Institute for Microelectronic Circuits and Systems IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.
Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.