Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES


Multitest releases 3D packaging test combination for sensitive bare die

07/09/2012 

Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.
More SEMICON West exhibit previews

07/08/2012 

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
EVG temporary wafer bonding platform doubles throughput for 3D packaging

07/04/2012 

EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.
MLCC manufacturers order ESI high-throughput test system

07/03/2012 

Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.
Epson launches high-throughput IC test handler for volume test

07/02/2012 

Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.
Ultratech acquires IBM patents for semiconductor packaging processes

06/29/2012 

Ultratech acquired IBM patents on semiconductor packaging technologies, including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging.
SEMICON West preview: Metrology, inspection, and process control products

06/28/2012 

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
2012 “Best of West” award finalists announced

06/28/2012 

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
JPSA picosecond laser micromachining platform reduces debris and thermal damage

06/26/2012 

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Dow Corning teams with SUSS on TSV bonding process

06/25/2012 

Dow Corning will collaborate with SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.
SEMICON West 2012 exhibits preview: Semiconductor packaging products

06/22/2012 

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering

06/21/2012 

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.
High-volume MEMS manufacturer adds FOGALE metrology tool

06/20/2012 

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.
AMAT’s Varian integration continues with Dickerson named president

06/20/2012 

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Fast-curing conductive chip-attach adhesive meets RFID packaging needs

06/20/2012 

DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.
Wafer-level RF testing bottleneck resolved with Advantest, Hua Hong NEC methodology

06/20/2012 

Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.
Signetics bolsters mobile chip packaging capacity with large tool buy

06/19/2012 

Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.
STATS ChipPAC ships 1 billionth package using copper wire bonds

06/18/2012 

STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped.
Anritsu plans on-wafer high-frequency test demo at IMS

06/15/2012 

Anritsu will demonstrate its broadband Vector Network Analyzer (VNA), which conducts single sweeps from 70kHz to 140GHz during wafer probe test, at IMS, showcasing a new 0.8mm connector.
Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging

06/14/2012 

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.



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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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