Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES


OSAT provider orders wafer inspection tools from Camtek

03/26/2012 

Camtek Ltd. sold $3.5 million of Falcon inspection tools to a global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend assembly process.
Keithley power semiconductor tester uses 3000V source

03/23/2012 

Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.
DOW opens semiconductor/display R&D center in Seoul with OLED focus

03/22/2012 

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Semiconductor capex to fall 11.6% in 2012, says Gartner

03/21/2012 

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
Teradyne tester boasts high throughput of consumer digital chips

03/20/2012 

Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.
SUSS combines resist coat and develop platforms

03/19/2012 

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment doubles manufacturing space with new NY facility

03/19/2012 

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
New LTXC semiconductor test tools suit ASSP, RF test

03/19/2012 

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.
Silicon Genesis wafering tool designed for solar, LED, packaging sectors

03/19/2012 

SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.
TEL acquires advanced packaging tool supplier NEXX

03/16/2012 

TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).
Presto installs LTX-Credence semiconductor test platform for RF wireless devices

03/15/2012 

Presto Engineering selected an LTX-Credence Corporation (Nasdaq:LTXC) X-Series platform for testing wireless communications, automotive and industrial customer devices.
Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

03/15/2012 

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

AMEC debuts TSV etch tool with Chinese installations

03/14/2012 

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
Shin-Etsu Chemical joins EVG wafer bonding supply chain

03/14/2012 

EV Group (EVG) welcomed Shin-Etsu Chemical  into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.

Semiconductor manufacturing equipment sales rose 9% in 2011

03/13/2012 

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
ULVAC cuts gold from package-level solder deposition process with sputtering methods

03/13/2012 

ULVAC Inc. developed solder deposition processes for silicon device manufacturing, including power devices, that sputters solder to deposit it rather than printing or evaporating the materials. The 2 processes eliminate gold, or gold and nickel, from the step.
Interposer supply/ecosystem examined at IMAPS Device Packaging

03/12/2012 

Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.
KLIC wire bonder debuts for low-pin-count, discrete packaging

03/09/2012 

Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.
K&S capillary specifically suits LED wire bonding

03/09/2012 

Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes

03/09/2012 

Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing. 




WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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