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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.
Nordson Corporation (NASDAQ:NDSN) opened a demo center in Dongguan, China for customers of its Advanced Technology Systems operating segment: Nordson ASYMTEK, Nordson DAGE, and Nordson YESTECH brands.
Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste.
JaroThermal's Honeycomb heatsink directs heat towards the outside of the device, while producing a steady flow of cool air inside the heatsink. Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages.
Carsem will grow its Suzhou, China factory by an additional 430,000 square feet, increasing their Suzhou micro leadframe package (MLP) capacity to over 20 million per day, with a focus on copper wire bonding.
Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.
Catalan Institute of Nanotechnology Professor Adrian Bachtold and his research group created resonators from nanoscale graphene and carbon nanotubes (CNT) that exhibit nonlinear damping. This result could lead to supersensitive detectors of force or mass.