08/20/2010 

SRC and researchers from Georgia Tech made two advancements to meet key challenges facing off-chip interconnect solutions. The results address both the urgent need for greater off-chip bandwidth and reduced power per bit, and promise to enable continued improvements for system performance.

08/19/2010 

SWeNT is manufacturing specialty multi-wall carbon nanotubes for NanoRidge Materials. These CNTs are being incorporated into enhanced body armor to improve protection of soldiers and law enforcement officers from small arms fire.

08/16/2010 

Rohit Pathak and Satyadhar Joshi analyzed the effect of innovations in nanotechnology on wireless sensor networks and modeled CNT-based sensor nodes from a device prospective. A WSN model was programmed in Simulink-MATLAB and a library developed. Average energy consumption for the system has been formulated and its reliability shown holistically. Changes are needed in existing sensor node structure to improve efficiency and the assimilation of CNT-based devices in a WSN. Finally, the authors comment on the challenges and factors of reliability.

08/13/2010 

Replicating nanostructures from the wings of Morpho butterflies, GE’s sensors would enable highly selective, near-instantaneous detection of chemical threats. GE’s sensing platform could create other industrial and healthcare applications, including emissions monitoring at power plants, water purification and food safety testing and breath analysis for disease detection.

08/12/2010 

Assembléon’s recently released Twin Placement Robot (TPR) will reportedly reduce costs for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment for packaging and IC placement. Plans are in the works for the TPR to do semiconductor manufacturing tasks as well.

08/10/2010 

The university's system addition will assist in the development of free-standing Fresnel zoneplates for neutral helium microscopes and support university work on biophysics experiments in surface engineering and nano-science experiments to test optical and magnetic properties of nanostructures.

08/09/2010 

The HDP User Group's Optical Interconnect project aims to alleviate intra-cabinet interconnect bottlenecks envisaged in Tbps systems by connecting electronic devices with optical paths. The project is developing optical interconnect architectures that can respond to capacity and energy efficiency needs of future high-speed systems.

08/09/2010 

The BIANCHO project (BIsmide And Nitride Components for High temperature Operation) will develop new semiconductor materials to allow lasers and other photonic components to become more energy efficient and also more tolerant of high operating temperatures.

08/05/2010 

Flametec fire-safe materials are formulated to exceed fire compliances for polymers in semiconductor, clean room, and other applications. Flametec is used for a variety of applications including tools, wet benches, cabinetry and furniture. 

08/04/2010 

Jeremy Lug, Dynamics Research Corporation Metrigraphics Division, goes over what you need to know to design bio-compatible medical electronics on time, on budget, and with FDA approval to sell. A lot of medical device engineering is tradeoffs between materials, processes, labor, and other factors.

08/03/2010 

Silicon nanoneedles with modulated porosity could improve healthcare devices by increasing energy storage, help realize implantable microchips, or make better drugs.

08/02/2010 

Japan Marketing Survey Co. Ltd. (JMS) will publish "Outlook of thermal interface material market 2010) this week, with data on the semiconductor package thermal management market size by application, thermal interface material types' market shares, and more.

08/02/2010 

Carl Zeiss SMT debuted an integrated gas injection system on the ORION Plus Helium Ion Microscope. The gas injector reportedly delivers superior nanofabrication, deposition and etch.

08/01/2010  With varying process conditions, the quantitative analysis of the interfacial adhesion energy of Cu-Cu thermo-compression bonds was performed. Bioh Kim, et al, EV Group, Inc., Tempe, AZ USA; Eun-Jung Jang, et al, Andong National University, Andong, Korea

07/30/2010 

Package on package (PoP) stacking makes use of the vertical space available on electronics printed circuit boards (PCBs). It increases density, fitting more silicon into the same footprint. However, package stacking can be difficult, as fine pitches require placement accuracy, and taller stacks generally face reliability issues, especially if the stack is reflowed improperly. So where should PoP stacking take place?

07/29/2010 

Graphene has been found to have a unique property that could make it even more suitable for future electronic devices. When subjected to a 3-point stretch, graphene sprouts nanobubbles with electrons moving as if subjected to a strong magnetic field. The discovery was made by physicists at the University of California, Berkeley, and the Lawrence Berkeley National Laboratory.

07/29/2010 

Teledyne completed the acquisition of Intelek plc. Teledyne was the beneficial owner of, or had received valid acceptances in respect of approximately 93% of Intelek's ordinary shares. The aggregate value for the transaction will be approximately £35 million.

07/28/2010 

The German high-tech company GFD has developed a super-sharp razor blade made of industrial diamonds that could last more than 1,000x longer than a conventional blade. Because GFD only produces the razor blade but not the finished razor, the company is exploring possible strategic alliances to develop this product for the consumer market.

07/27/2010 

DXR Nanocarbon Analysis Packages offer large-scale chemical and materials producers complete systems for CNT analysis. The packages provide information on the molecular structure and morphology of carbon nanomaterials.

07/27/2010 

Rogers Corporation has developed a match for the RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant (Dk) of 6.15 ±0.15 and low dielectric loss of 0.003 at 2.5GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high-frequency (HF) circuits in limited space.