Packaging

PACKAGING ARTICLES

Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch

03/20/2012

Imec developed a via-middle approach to through-silicon via (TSV) manufacturing for 3D packaging, using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer.

Teradyne tester boasts high throughput of consumer digital chips

03/20/2012

Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.

SUSS combines resist coat and develop platforms

03/19/2012

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.

CVD Equipment doubles manufacturing space with new NY facility

03/19/2012

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.

New LTXC semiconductor test tools suit ASSP, RF test

03/19/2012

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.

Silicon Genesis wafering tool designed for solar, LED, packaging sectors

03/19/2012

SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.

TEL acquires advanced packaging tool supplier NEXX

03/16/2012

TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).

Amkor (AMKR) names Taiwan leader with semiconductor packaging background

03/16/2012

Amkor Technology Inc. (Nasdaq: AMKR) added Mike Liang as president of Amkor Technology Taiwan. Liang's background includes stints with Phoenix Semiconductor, Ti-Acer, UMC, and others.

Presto installs LTX-Credence semiconductor test platform for RF wireless devices

03/15/2012

Presto Engineering selected an LTX-Credence Corporation (Nasdaq:LTXC) X-Series platform for testing wireless communications, automotive and industrial customer devices.

Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

03/15/2012

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

AMEC debuts TSV etch tool with Chinese installations

03/14/2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.

Shin-Etsu Chemical joins EVG wafer bonding supply chain

03/14/2012

EV Group (EVG) welcomed Shin-Etsu Chemical into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.

Semiconductor manufacturing equipment sales rose 9% in 2011

03/13/2012

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.

ULVAC cuts gold from package-level solder deposition process with sputtering methods

03/13/2012

ULVAC Inc. developed solder deposition processes for silicon device manufacturing, including power devices, that sputters solder to deposit it rather than printing or evaporating the materials. The 2 processes eliminate gold, or gold and nickel, from the step.

Interposer supply/ecosystem examined at IMAPS Device Packaging

03/12/2012

Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.

KLIC wire bonder debuts for low-pin-count, discrete packaging

03/09/2012

Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.

IBM drills optical vias in chip for 1Tbit/sec transmission

03/09/2012

IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.

K&S capillary specifically suits LED wire bonding

03/09/2012

Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.

Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes

03/09/2012

Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing.

Micro glass drilling enables 0.1mm semiconductor interposers

03/08/2012

AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

PACKAGING ARTICLES

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