08/10/2011 

Post-22nm and below, the industry is going to fully depleted structures, either FinFETs or fully-depleted planar SOI (FDSOI), explains Soitec's Steve Longoria.

08/09/2011 

IC manufacturers are becoming more aggressive with strain engineering as they go from 28nm to more advanced nodes, explains Jeff Hebb, VP of laser product marketing at Ultratech. The company is working on a dual-beam laser-spike annealing to address requirements for 20nm and 14nm.

08/09/2011 

Doug Anberg, VP of advanced stepper technology at Ultratech, discusses the physics behind improvements in the company's new Sapphire 100E HB-LED tool in a video interview at SEMICON West 2011.

08/09/2011 

In a podcast interview, Arlon Martin from Kotura discusses the changes in processes that fabs will have to make when integrating silicon photonics onto chips to support optical circuits.

08/09/2011 

Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.

08/08/2011 

Leti's Serge Tedesco, lithography program manager, provides an update on the research group's 193 optical lithography program for 22nm and below, and exploration of multi e-beam lithography techniques.

08/04/2011 

Ludo Deferm, IMEC, came to SEMICON West with several major announcements, from the system level to the layers of semiconductors. IMEC's major interests include scaling with 3D technologies, selective epitaxy, RRAM, lithography, and more.

08/04/2011 

LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.

08/04/2011 

Apple Inc.'s iPad has thus far thwarted competitive tablets in design efficiency, according to an IHS iSuppli Teardown Analysis of eight tablet models from IHS. Major savings come from Apple's control of chips like SDRAM and applications processors.

08/03/2011 

Industry analysts explain the strategy behind Samsung's acquisition of MRAM developer Grandis, the potential for this and other next-generation memory technologies, and why NAND flash is still firmly in the driver's seat.

08/03/2011 

While silicon semiconductor wafer growth was nearly flat year-over-year -- up 1% in Q2 2011 over Q2 2010 -- the unbroken supply chain is impressive in the immediate aftermath of the earthquake and ensuing tsunami in Japan.

08/02/2011 

IC maker Samsung Electronics Co. Ltd. acquired Grandis Inc., a Silicon Valley maker of spin transfer torque random access memory (STT-RAM).

08/02/2011 

Data I/O Corporation (NASDAQ: DAIO) debuted the RoadRunner3 in-line programming system, a just-prior-to-placement programming tool with modules to automate processes and eliminate operator interventions.

08/02/2011 

Global semiconductor sales slipped in June 2011, and were down even more for the quarter -- a period that usually sees an upswing after the traditionally slow year-opening quarter.

08/01/2011 

Dongbu HiTek began volume production of high dynamic range (HDR) CMOS image sensor (CIS) chips for BYD Microelectronics.

08/01/2011 

SATS provider Unisem purchased a LTX-Credence PAx RF Test System for its Sunnyvale, CA, test development center, joining other recent test/wafer equipment purchases at the site.

08/01/2011 

Silicon carbide parts for semiconductor applications rose sharply in 2010, up 38% year-over-year to $200 million, according to Techcet. SiC fell 5% shy of the 2008 peak, and will see continued growth.

07/29/2011 

Ricky Jackson, Texas Instruments (TI), discusses analog IC developments, and how analog and digital semiconductors are pursuing Moore's Law and More than Moore in different ways. He also touches on TI's new fab capacity.

07/28/2011 

Texas Instruments has shipped more than 30 million units of its PowerStack packaging technology, a combination of chip stacking and clip bonding that is designed to improve performance and chip densities in power management devices.

07/27/2011 

SEMICON West may not be the big-iron displayfest it once was, but there are still plenty of new product introductions to go around. Here's just a brief rundown of some of the ones we tracked from this year's show.