|
|
WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Sponsored By:
Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
Sponsored By:
More Webcasts
|
LORD Corporation launched the ME-555 underfill encapsulant for semiconductor packaging and assembly. LORD ME-555 is a high-purity, semiconductor-grade epoxy underfill for encapsulating flip chips.
FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.
Apple bought the most semiconductors of all original equipment manufacturers (OEMs) in 2010, largely to build iPhones and iPads, according to IHS iSuppli (NYSE: IHS) research. This is Apple's first trip to the #1 spot, after being third in 2009 and sixth in 2008.
SuVolta is tackling the low-power challenge of mobile SoC devices with its PowerShrink platform and undoped, deeply depleted channel (DDC) technology. Scott Thompson, SuVolta, says DDC technology produces high performance at low voltage because it enables inversion charge to move from source to drain without scattering with dopants. The undoped channel and screening regions provide threshold voltage variation as good as the best fully-depleted SOI and fully-depleted FinFET research devices.
UC San Diego researchers developed a phase change memory (PCM) solid-state storage device (SSD) that claims 7x speed improvement over current SSDs. The project has backing from Micron Technology, BEEcube, and Xilinx.
The requirement for CMP slurry to perform consistently during the wafer polishing process has resulted in a push on the part of IC manufacturers to improve slurry metrics. Marty Mason, Vantage Technology Corp., explains how on-wafer slurry conditions can differ from slurry measurements, and new advances to rectify measurements.
Sharon Stiefel, IHS iSuppli, reports that a cushion in the semiconductor supply chain helped balance out off-line fabs in Japan following the Sendai-area earthquake and tsunami. As fabs ramp back up, or products are transferred to lines in other facilities, Q2 should avoid component shortages as well. But will the disaster be the end of just-in-time inventory management?