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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.
Today at The ConFab, John Chen (Nvidia), Jeong-ki Min (Samsung Electronics), and Abraham Yee (Nvidia) gathered foundry, OSAT, and chip maker leaders to discuss what happens beyond Moore's Law. The following are key points from "Collaboration to Strengthen the IC Supply Chain."
Bill Tobey, ConFab advisory board member and president of ACT International, discusses the role of fab managers in today's chip manufacturing environment. After the 2008 financial fallout, and 3 years of recovery, 2012 and onward present challenges and opportunities for research and development, collaboration, etc.
MIT and University of Augsburg researchers discovered that layered insulators lanthanum aluminate and strontium titanate create a capacitance -- at room temperature -- that cannot be explained by existing physics. The discovery could create entirely new transistors that do not rely on silicon semiconductors.
Rudolph Technologies (NASDAQ: RTEC) released the Wafer Scanner 3880 to inspect micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used in 3D IC packaging.
CMOS image sensors did not see the same strong rebound in 2010 that the semiconductor industry at large experienced. New momentum, driven by new system applications outside of camera phones and digital still cameras, could focus CMOS image sensors on growth from 2011 on, says IC Insights.