Semiconductors

SEMICONDUCTORS ARTICLES



SMSC, Intel expand partnership

09/11/2003  September 9, 2003 - Fabless semiconductor supplier Standard Microsystems Corp., Hauppage, NY, and Intel Corp., Santa Clara, CA, have enhanced their partnership in advanced input/output devices.

Simtek samples 1MB SRAM

09/11/2003  September 9, 2003 - Simtek Corp., Colorado Springs, CO, says it is sampling intitial production of its 1Mbit SRAM chips.

Samsung pours money into DRAM

09/11/2003  September 9, 2003 - Samsung Electronics Co. says it will invest up to $432 million over the next two years to boost output of its DRAM and flash memory chips.

AMAT steps into SEM metrology

09/11/2003  September 9, 2003 - Applied Materials, Santa Clara, CA, has unveiled a new tool for 65nm-generation mask metrology, adding to its line of pattern generation, etch, and inspection tools.

IBM, Agilent to shrink optics for computers

09/11/2003  IBM and Agilent Technologies Inc. are teaming up to develop optical transmission technology small enough to enable rapid connections within computers, according to a news release.

Nantero secures $10.5M in funding

09/08/2003  Sept. 8, 2003 – Nantero Inc. announced it received $10.5 million in second-round funding. The new lead investor is Charles River Ventures. Bruce Sachs and Bill Tai, both partners at the venture firm, have joined Nantero's board of directors. Returning investors include Draper Fisher Jurvetson, Stata Venture Partners and Harris & Harris Group.

SIA: July chip sales up, future looks bright

09/05/2003  Worldwide semiconductor sales totaled $12.90 billion in July, up a bit from the $12.54 billion in revenues reported in June 2003, and a healthy 10.5% jump from $11.68 billion in sales a year ago, according to data from the Semiconductor Industry Association (SIA).

Nanometrics unveils metrology tools

09/05/2003  Nanometrics, Milpitas, CA, has introduced a pair of integrated metrology tools combining optical critical dimension spectroscopic ellipsometry with deep UV spectroscopic reflectometry.

Silecs pursues a non-porous low-k solution

09/05/2003  Start-up Silecs has joined the ongoing industry battle between CVD and SOD processes used to make low-k dielectrics with its own organosiloxane-based low-k dielectric material that is effectively non-porous.

Mosel Vitelic to sell ProMOS shares

09/02/2003  September 2, 2003 - Mosel Vitelic, Taipei, Taiwan, has applied with the Taiwan Stock Exchange to sell 90 million shares of ProMOS Technologies, nearly 11% of its stake in the DRAM chipmaker.

Xignal launches front-end design IP

09/02/2003  September 2, 2003 - Xignal Technologies AG, Munich, Germany, an IP provider for the communications semiconductor industry, has released a new AFE design for mixed-signal ICs.

TSMC: Wireless chips driving sales

09/02/2003  August 29, 2003 - Sales of wireless communications chips will drive sales in 3Q03 for Taiwan Semiconductor Manufacturing Co. (TSMC), a company official told Dow Jones.

MEMGen changes name

09/02/2003  September 2, 2003 - MEMGen, Burbank, CA, has changed its name to Microfabrica, in order to more clearly define what the company does.

SMIC buying chip equipment

09/02/2003  September 2, 2003 - Calling all equipment makers -- Shanghai-based semiconductor firm SMIC wants to buy $1 billion in chipmaking equipment for its new plant in Beijing, according to local reports.

Advanced Micro hits 90% capacity

09/02/2003  August 28, 2003 - Taiwan's Advanced Microelectronic Products is operating at over 90% capacity at its 6-in. wafer fab, according to a local report.

RF Micro qualifies 6-in wafers

09/02/2003  August 27, 2003 - Wireless chipmaker RF Micro Devices, Greensboro, NC, says it has successfully completed customer qualification of its 6-in. wafer manufacturing capabilities.

CSMC, Chartered forge equipment pact

09/02/2003  August 28, 2003 - Chartered Semiconductor, Singapore, has signed an agreement to sell used equipment and technology to CSMC Technology Corp., a 150mm IC foundry in Hong Kong, in exchange for $33 million in cash and shares.

Sino-American Silicon gets order boost

09/02/2003  August 28, 2003 - Wafer manufacturer Sino-American Silicon says it has renewed a three-year, $8.8 million procurement deal with Danish firm Topsil.

Elpida, Toppan ink photomask deal

09/02/2003  August 27, 2003 - Elpida Memory, a Tokyo, Japan JV between Hitachi and NEC, and Toppan Printing Co. have agreed to co-develop photomasks for sub-100nm DRAM chips. The photomasks will be used on chips produced at Elpida's 300mm facility in Hiroshima.

STMicro to close French plant

09/02/2003  August 27, 2003 - STMicroelectronics plans to close its 6-in. wafer plant in Rennes, France, and transfer work to a facility in Singapore.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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