(August 17, 2010 – BUSINESS WIRE) — Veeco Instruments Inc. (Nasdaq: VECO) agreed to sell its Metrology business to Bruker Corporation (Nasdaq: BRKR), a leading provider of high-performance scientific instruments and solutions for molecular and materials research, for $229 million in cash. The transaction has been approved by the Board of Directors of both companies and is expected to close in the fourth quarter of 2010, pending regulatory review and subject to customary closing conditions.
The sale will transfer Veeco’s worldwide Metrology business to Bruker, including Veeco’s Atomic Force Microscope (AFM) business in Santa Barbara, CA and its Optical Industrial Metrology (OIM) business in Tucson, AZ, as well as Veeco’s associated global AFM/OIM field sales and support organization. Bruker intends to combine Veeco Metrology with its global Bruker Nano instruments business, which currently sells a broad range of systems and analytical solutions for materials and nanotechnology research. Veeco currently expects cash proceeds from the transaction to be approximately $160 million net of estimated applicable taxes and transaction fees. Additional terms of the transaction were not disclosed. Citigroup Global Markets Inc. acted as exclusive financial advisor to Veeco in connection with the transaction.
John R. Peeler, Veeco’s CEO, commented: "Following the sale of Metrology, Veeco expects to benefit from greater focus on and investment in our LED & Solar and Data Storage Process Equipment businesses. We believe the sale of Metrology will allow us to accelerate our progress developing new products, gaining share, and aligning with key customers in markets with large growth opportunities, including several "clean tech" markets. The sale is also expected to give us additional financial flexibility to pursue acquisitions and expand customer support for our growing Asia business."
Peeler continued, "Veeco Metrology is a great business that is strong, growing and profitable and has many exciting new products. Even so, it lacks meaningful synergies with our Process Equipment businesses in technology, distribution and customers. We believe it will be a better fit as part of a large and successful instrumentation company, such as Bruker, where the focus will be on continued development of innovative scientific instruments. We have great confidence that the Metrology business will continue to grow and prosper as part of Bruker."
Frank H. Laukien, Bruker’s President and CEO, added: "We are excited to add Veeco’s industry-leading scanning probe microscope (SPM) and optical metrology systems to the Bruker product portfolio of high-performance materials research and nanotechnology instruments. We very much look forward to welcoming the customers, management and employees of the Veeco Metrology business to Bruker after the closing of the transaction."
Veeco will account for the Metrology business segment as a "discontinued operation" effective August 15, 2010. Veeco is therefore updating guidance for third quarter 2010 revenue from continuing operations to be in the range of $255-280 million, with GAAP earnings per share between $1.45 and $1.72 and non-GAAP EPS between $1.13 and $1.33. Please see attached GAAP reconciliation table. Without Metrology, Veeco’s updated guidance is that 2010 revenues from continuing operations will be approximately $1 billion, with about 90% from the LED & Solar business segment.
Veeco Instruments Inc. designs, manufactures, markets and services enabling solutions for customers in the HB-LED, solar, data storage, semiconductor, scientific research and industrial markets. http://www.veeco.com/
Bruker Corporation (NASDAQ: BRKR) is a provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for industrial and applied analysis. For more information: http://www.bruker.com
(August 17, 2010) — Rohit Pathak, Acropolis Institute of Technology & Research, Indore, M. P., India and Satyadhar Joshi, Shri Vaishnav Institute of Technology & Science, Indore, M. P., India, have analyzed the effect of innovations in nanotechnology on wireless sensor networks (WSN) and have modeled carbon nanotube- (CNT) based sensor nodes from a device prospective. A WSN model has been programmed in Simulink-MATLAB and a library developed. Integration of CNT in WSN for various modules such as sensors, microprocessors, batteries etc has been shown. Also, average energy consumption for the system has been formulated and its reliability has been shown holistically. A proposition has been put forward on the changes needed in existing sensor node structure to improve its efficiency and to facilitate as well as enhance the assimilation of CNT based devices in a WSN. Finally we have commented on the challenges that exist in this technology and described the important factors that need to be considered for calculating reliability. This research will help in practical implementation of CNT based devices and analysis of their key effects on the WSN environment. The work has been executed on Simulink and Distributive Computing toolbox of MATLAB.
The proposal has been compared to the recent developments and past experimental results reported in this field. This attempt to derive the energy consumption and reliability implications will help in development of real devices using CNT, which is a major hurdle in bringing the success from lab to commercial market. Recent research in CNT has been used to model an energy efficient model which will also lead to the development CAD tools. Library for Reliability and Energy consumption includes analysis of various parts of a WSN system which is being constructed from CNT. Nano routing in a CNT system is also implemented with its dependencies.
Finally the computations were executed on a HPC setup and the model showed remarkable speedup.
The combination of recent technological advances in electronics, nanotechnology, wireless communications, computing, and networking has hastened the development of Wireless Sensor Networks (WSNs) technology. Since CNT remains the main technology that threatens the CMOS technology due to its immense interesting properties our work has been to realize where the technology stands and the results of energy and reliability modeling. Wireless Sensor and Actor Networks (WSANs) constitute an emerging and pervasive technology that is attracting increased interest for a wide range of applications. WSN see application in various areas like space research, biomedical engineering, military applications such as battlefield surveillance and the quest for making low power, reliable and cheap sensor nodes has been a prime focus in recent years.
Nanotechnology has enabled realization of low power devices such as MEMS devices and CNT based FETs [11-12]. CNT based sensors have shown many benefits over their past counterparts and are suitable candidates in this Nanotechnology driven age [24]. Nanotechnology uses the smallest unit of matter to engineer new materials and devices atom by atom, aiming at achieving superior properties and performance through atomic scale architecture. An improvement in techniques of Nanocharacterization and Nano-fabrication has helped us to pave the way to develop many novel materials that can be applied to various spheres of technology. For example the impact of Nanotechnology on Wireless Communications has been shown by Er. Ping Li in [14]. An Architecture of Quantum-Based Nano-sensor Node for Future Wireless Sensor Networks has been proposed in [10]. WSN with Biomedical Applications has been shown by Zachary Walker describing the importance of Middleware [22]. Miniature Acoustic Communication Subsystem Architecture for Underwater Wireless Sensor Networks has been proposed by Saunvit Pandya [33]. WSN architecture for the Wireless Health Mobile Bio-diagnostic System for physiological studies has been proposed [34]. In our previous work, we have shown Nano based WSN where the importance of CNT and MEMS technology in WSN has been shown [32]. WSN plays a very important role in the overall development of a developing nation, which is being felt in the recent years [4]. Also planetary sensing applications have been proposed in recent years [6]. In this paper we have proposed energy and reliability models for a CNT based WSN. The models were developed using Simulink and Distributive Computing Toolbox, which were tested on a HPC setup.
CNT sensors and nano processors
Research on carbon nanotubes is yielding many results in labs and many theories are being proposed, but many parallel work on areas like reliability, packaging and energy constrains in CNT devices are still not being explained. Realization of CNT based sensors devices can make them a suitable candidate for WSN sensor nodes. Functional CNT can lead to novel device application giving advantages of their unique properties [25]. We know that conductance of CNT depends on the rolling of the graphene sheet which in turn depends upon the chiral vector Ch as given by the equation
Ch =na1 + ma2 (1)
Here n and m are integers and a1, a2 are unit vectors in the bi-dimensional hexagonal lattice of the graphene sheet. The radius of the nanotube being
R = a0(n2 + m2 + nm)1/2 /2π (2)
This is most basics idea of CNT that is known to all. Mathematics of CNT and their latest paper in this regard has been discussed in later part of the work. Hence we can model a sensor dependent on the above parameters as follows: 1. Define m, n and calculate the radius required for the particular sensor as electronic structure (energy band gap structure) depends on the integers m and n. 2. Take note of the impact of working temperature and environmental factors on the reactivity of CNT like hydrogenation, oxygenation, NO2, NH3, CO, O3 as studied in [24, 25]. 3. Effect of elasticity, mechanical motions and effect of other adsorbent on CNT surface. 4. Predicting the reliability of the sensor.
Fig. 1. Interaction of CNT and other molecules.
We know that variations in current conductance properties of CNT make it a useful for detecting gas and chemicals. We can illustrate the variation of current vs. time in a CNT based sensor from the graphs in [24]. The special semiconducting properties of CNTs have been exposited that makes them a suitable candidate for the future development of Nano-processors and Nano-scale circuitry [28, 30-31]. Atashbar et al. [37] has asserted that SWNT (Single Wall Nanotube) based efficient gas sensor using SWNT functionalized with Sodium Dodecyl Sulfate improved the solubility of SWNT in DI water significantly. He proposes that this functionalization reduces the short range attraction forces by introducing repulsive forces of equal strength and this result in the alteration of structural, electronic, and mechanical properties of the nanotubes. We are aware that there is a change in conductance of CNT on absorption of CO, NH3, CO, O3 NO2 and O2 and other gases [24]. Jing Li [18] has proposed a unique and marketable way to develop Nano-scale chemical sensors with polymer-coated CNTs for selective chemical sensing in gas phase. But we need more exploration in coating and doping techniques for broad application coverage. Carbon Nanotube also sees its very important application in biosensors [9, 13]. The main challenge for any engineering application of CNT is its reliability and interconnects. The effect of various gases has on CNT is shown in Fig. 1.
Modeling of low-bias electronic transport in ballistic conductor. There are various models developed for calculating the conductance of CNT. In this section the most applicable model is stated from the literature which is then implemented to calculate the energy consumption and reliability analysis. We know that Electronic transport in ballistic conductors can be assumed as the sum of IL and IR the currents flowing right and left; this forms the basic model of calculating current in CNT based devices where it is capable of carrying high currents [1]
(3)
(4)
Here D(E) is the density of states in units of (states/eV/nm), ν(E) is the electron velocity and f (E) is the Fermi function with Fermi levels EFR in the right lead and ELF in the left lead. These equations are simply expressing the fact that the current at energy E is the product of the number of charges ε D (E) f (E – EF) and their velocity ν(E). This is the current through metallic CNTs which forms the basis of the WSN network based on CNT. The total sum of right and left current in a ballistic system is thus
(5)
The difference of the Fermi functions implies that most of the current will flow between the two Fermi levels. There are two generalizations of the above derivation that need to be considered when describing transport through real systems. The first is that in general there may be several modes that contribute to the current, and each mode will contribute one quantum of conductance. The second point is that, because of scattering processes in the conductor, the electron transmission probability may be less than unity. Putting this together gives the final expressions for the current
(6)
And the total conductance (including spin) is given as
(7)
Thus this part of the system is the observation for conducting CNTs now in our work we have worked on the reliability and energy consumption as shown classically in [1].
CNTsensors. Sensors are the most important applications of CNTs. The sensing mechanism and the charge transfer needs to be modeled for the sensor part of the wireless sensor network. Using the expression for the capacitance per unit length of a CNT we can obtain an expression for the maximum relative change in conductance [27].
(8)
At the other end of the spectrum, one can consider the impact of a single analyte on the nanotube conductance. Under the assumption that the transferred charge is delocalized over the entire channel length, we can estimate the relative change in conductance to be
(9)
The appearance of the channel length is made explicit in this expression. This equation relates the conductance with channel length so it is an important part of parameter. For detection of analytes of concentration c in a gas or liquid phase, it is useful to relate the surface coverage θ to the analyte concentration. This can be accomplished by considering equilibrium surface coverage with analyte binding energy Eband analyte chemical potential in the gas or liquid μ. The partition function is then given by
(10)
Here zvib is the vibration contribution. The expression for the concentration dependence on the coverage can be combined with that for the threshold voltage shift, to obtain
(11)
Contacts and interconnect. The most important issue that is being talked about is contacts and interconnects in a CNT-based system. This research is also very useful for developing CNT based NOC which is an area of research for the near future. The presence of charge near the interface will change the electrostatic potential and hence the electrostatic potential in the semiconductor (z > 0) is calculated as [2]
(12)
The first term in this equation is the potential due to the image charge in the metal while the second and third terms arise from the charge in the semiconductor. This is the part which needs to be studied in light of reliability and energy consumption. Thus the electrostatic potential hence derived is
(13)
Thus we can see that Vbulk (z) is given above it where the potential attains a constant value at z>>q-1 which is
(14)
Diode of CNT systems. Diode as we see is one of the main things that are used in the circuitry which is being shown in this part. Assuming that the band edge simple tracks the Fermi levels in the leas (i.e. far away from the junction), the diode physics of CNT is shown as [3]
(15)
(16)
Here E∞ c is the energy of the conduction band edge on the n-type side far from the junction. As shown above it is the celebrated ideal diode equation describing rectifying behavior, except that here it was derived under the assumption of ballistic transport. This is important for considering the current in the diode part. I here is the celebrated ideal diode equation describing rectifying behavior, except that here it was derived under the assumption of ballistic transport.
Ohmic contacts and transistor. Temperature has been a major issue that needs to be taken in account. The temperature dependence of the ON state conductance also provides further evidence for the presence of ohmic contacts. Assuming perfect transmission through the contacts and the nanotube, the obtained temperature-dependent ON state conductance as [5]
(17)
Here Δ = EV − EF represents the position of the Fermi level in the valence band. The conductance G monotonically decreases with increasing temperature in agreement with the work done earlier. Thus, even in carbon nanotube field effect transistors without electron–phonon scattering it is expected that the conductance will decrease with increasing temperature, and can be reduced by as much as a factor of two at room temperature compared to its low- temperature value. Expression for conductance in a Schottky barrier nanotube transistors is [2, 7]
(18)
Here
(19)
Here tox is the gate oxide thickness. The much different physics behind the operation of Schottky barrier nanotube transistors has important implications on the scaling of various performances parameters with device dimensions. As discussed above, it was predicted that reducing the thickness of the gate insulator improves the sub threshold swing because it allows the gate to more effectively modulate the band-bending at the contact. Such a behavior has been verified experimentally by fabricating nanotube transistors with gate oxide thickness between 2 and 20nm. Thus this is the study of the CNT based transistor.
CNT electromechanical systems. Once the transmission probability is known for the relevant range of energies, the conductance is calculated from [3]
(20)
Here Tij is transmission probability between bands i and j. This equation signifies the relations of bending vs change in conductance. Impact of bending causes change in bond length which causes change in conductance which is shown. For the metallic nanotubes, a band-gap opens around the Fermi level, and the conductance at the Fermi level follows the relation [26]
(21)
Model for power consumed in a CNT-based WSN
Contemporary work in computation of WSN reliability is pretty generalized and Nano-scale devices based WSN has not been the sole focus of the research done in this area. In our previous work we have shown that MEMS reliability can be calculated using HPC thus making their practical applications possible [38, 37]. Effects of the failure of sensor nodes are studied and no compromise data acquisition methods have been proposed in [21]. Requirement for sustained, reliable and fault-tolerant operations have been conferred and a solution has been proposed by Kaminska in [15]. In this regard, the reliability calculations by probabilistic graph models and algorithm have been demonstrated by Hosam M. F. Abo El Fotoh [17]. Reliability studies in respect to Common Cause Failures have been examined [20]. Modeling and evaluating the reliability of Wireless Sensor Networks as subject to common cause failure has been described in [18]. Data transport and the reliability of data transport protocols have been discussed in [19]. Thus if we can predict the cause of failure then we can modify the protocols in our system accordingly. In Nano domains the failure can be caused due to large number of problems and errors which needs to be modeled and predicted in advance. Ad hoc wireless architecture has been introduced by Kamiska in [15] for the sustainability of self-configuring Wireless Sensor Networks and the routing scheme forwards sensor data along fuzzy and intentionally redundant paths to provide for reliability and fault-tolerance has been proposed. In [23] Zhand Dingxing discusses coverage algorithm based on probability to evaluate point coverage. Reliability in Wireless Sensor Networks using Soft Sensing and Artificial Neural Network methodology has been demonstrated by Rubina Sultan [21]. Optimizing availability and reliability in Wireless Sensor Networks applications by the use of middle wares has been shown in [16]. Thus we need to develop middleware in accordance with the challenges that exist. The CNT memory developed is not considered in our model [29, 35].
Current consumed in all elements can be distributed as follows: Ip = current in processor Is = current in sensor Id = current in diode I em =current in Electro mechanical CNT Idp = CNT diplay device if attached Icon = Contact of metal and CNT Itrs= current in transporting Energy consumed in V12 G1 + V22G2 + V32 G3 + V42G4 + V52G5
(also we need to take into account the Capacitance of the inter connects for the energy consumption: G1 is conductance in processor of FET based on CNT, here it’s a function of L (Length of nanotube) and energy consumed in capacitance: G2 is the conductance in sensor is also depended in L G3 diode does not depend on Length G4 current depends on deformation and bond length not L G5 It depends on L G6 does not depend on length; here capacitive effects may come into picture. Thus total energy consumption is a function of L length of the tube, length of the sensor tube, length of the display tube E = f (I, L1, L2, L3, Number of contacts,) (Assumed for diameter to be constant)
This can be done using MATLAB Distributive Computing Toolbox to calculate energy consumption at various temperatures so that we can model the circuit in the desired way. Using HPC needs to done in an optimum way by correct distribution of the jobs in the work load. Thus to calculate E we need the power of HPC to distribute the various parameters on an HPC setup because the system is complex. Capacitive effects on joining points or inter connects needs to be also taken in account which is ½ CV2. In most the cases it is can be considered in Diode and Contacts. If all of the system is just made of CNT then all the energy consumed in each part will be a function of CNTs parameter such. Our model results are done on HPC but an abstraction level function for overall consumption of the energy can be stated as
P= K1e-k 1 V (Energy used in circuit) + K21/2 CV2 (Energy lost at interconnect) (22)
Fig. 2. Y axis X axis, P vs. V(applied) for a derieved CNT WSN system.
Fig. 3. Graph between Power Consumed vs. Voltage applied vs. Capacitance of the system.
First term is of energy used in circuitry and 2nd term is for the interconnects. The variations can be seen in the figure plotted with the help of derived equation in Fig. 2 and taking all 3 parameters with number of inter connects, current, power the variations are shown in Fig. 3. It can therefore be used in an abstraction way as the formulae above but for accurate calculations we need high computation power, which can be done. Thus using this equation we can calculate the energy consumed in a CNT based Wireless Sensor network. But reliability and performance of the Node in a CNT based Sensor Node depends on the Sensor, Nano-processor, Nano-battery sources. Thus we need to make appropriate changes in the middle ware and Operating System. The energy for such a system can be derived from a MEMS better-less system where energy is induced in transponders, recent proposals shows real prospectus of such a technology maturing [8].
Unified reliability model developed for nano WSN
Probability function density of the failure for the device can be calculated as follows: f(t) is depended on frequency CNT device operate, electrostatic forces and electromagnetic forces it is subjected to, material which defines the strength of the device in various forms. υ= frequency of operation, also the frequency of CNT antenna will have a part in the function κ = stress it is subjected to, this is reaction RA and damping force as described earlier in case of a CNT mechanical sensors η = viscosity of the medium (which is most cases air) for a CNT mechanical sensor ЄC = electro static and effect, like capacitance based which for example shows at the interconnect of Carbon Nanotube metal junction ЄM=electromagnetic forces, like for inductive CNT antenna and transponders there is no mechanical motions but force due to inductance and induced voltages M (ρ, С, r) = material properties of the device, which also is the parameter of the density, head capacity, resistivity, strength and dielectric capabilities Ī=current flowing in the device for example which can be derived of various part of CNT based circuitry To=in some cases temperature may also be a cause of discrepancies which needs to be taken in account f(t) is a function of υ, κ, η, ЄC, ЄM, M (ρ, С, r), Ī,To
We have discussed the physics of these devices which is where we have given the current through various parts of the system.
It is assumed that the function will be exponential with some modification since it’s a standard reliability function used. It is obvious that f(t) will increase with υ, κ, η, ЄC, ЄM, M (ρ, С, r), Ī,To
As these parameters are linked to the failure rate therefore to insert their equivalent they are calculated by operator f’ where increase in any of them will increase the failure of the device, this operator converts the respective value to a function that needs to be inserted in the main failure probability distribution equation. Also it is obvious that the variation will have an exponential distribution for the failure rate distribution which can be derived from the basic principle of exponential distribution of reliability theory. So,
(23)
(24)
We have assumed we are given all parameters and they remain constant throughout the cycle of the CNT device then (f(υ) + f(κ) + f(η) + f(ЄC) + f(ЄM ) + f(M (ρ, С, r)) + f(Ī) + f(To)) = λ is assumed constant for computation that is being done on MATLAB. This formulation developed need to be modified as the exact dependencies of a case specific CNT device for example CNT based RFID or CNT based WSN. For example we need to derive for RFID which has CNT based antenna and transponders.
(25)
where I is the current through the system, n is the number of interconnects, and L is the approximate length of CNT used in the system. The failure probability distribution can be visualized as given in Fig. 4. And assuming only current and no interconnect effects the system behaves as shown in Fig. 5.
Fig. 4. Failure probability distribution f(t) vs I (current) and n (number of inter connects), which is the function derived.
Fig. 5. Failure rate function vs. I (current in the device) with no capacitive effects.
f(t)=( I + n+ L) e -(I + n+ L)(26)
The other model can be assumed in case the system is behaving in alternative way which is not satisfied by the first one can be seen in Fig. 6.
f(t)=( I n L) e -(I+ n L) (27)
Fig. 6. Failure probability distribution f(t) vs. I (current) and n (number of inter connects).
Thus for many CNT based devices in a WSN that are arranged in serious the probability of combined functioning can be calculated by the formulae below
(28)
A series system’s reliability decreases (increases) if the reliability of any unit decreases (increases). A series system’s reliability decreases (increases) if the number of units increases (decreases). A series system’s reliability is worse than the reliability of any of its units. Switching technology has been used very effectively and since at MEMS devices we have MEMS switches to shift to the redundant part of the system we need to analyze the reliability of the system with switch added. In a CNT system we can also use them. Psyst(t)=PSD(t)Pm(t) where Pm(t) is the probability of failure free operation of redundant group, PSD(t) of switching device and Psyst(t) of the system as a whole. A specific reliability function of switching device can be calculated in this way. Other miscellaneous issues that might come into factor are discussed below: Reliability of CNT depends on miscellaneous factors such as: 1. Functional group(s) attached, length and chirality of the CNT molecule 2. Packaging model used 3. Integration with other devices and interconnects 4. Other factors such as temperature and environmental parameters
Developed model for nano routing. Now we need to find a path in which the distance, the load at node (which is defined in terms of n which is also the number of connection is made) and the energy conservations to makes least energy dissipation for routine in a CNT based sensor network. Now this energy loss will be calculated by each node and then it will decide the path of propagation. Nanotechnology has enabled modeling of Nano antennas and MEMS technology enable transducers thus we can see that energy consumption can be greatly minimized. Propagation of waves is an independent area for a WSN and routine methodology formation can be worked as shown below: Here we have calculated the energy loss as a function of distance, load on the device, and the Voltage at which the CNT device is working. We know that Energy at a distance r is Er= k/r2 (this is the relation of the energy received at a distance r and k is assumed constant) by classical propagation theories. Now the energy loss is a function EL=f(lt,nl, Nf)
EL = k/l2t + nl + (K1e-k1V + K21/2 CV2), (29)
lt = length at which the transmission is to be made; Nf = Nano-factor for a CNT which is dependent on the energy conservation formulae derived in the earlier part, which is assumed as the energy conserved in the CNT as a function of Voltage which may be induced by MEMS transducers in this case; nl = load due to n devices at a node, which can also be said as the load complexity and also weighted value can be taken, in some cases it is the interference or the number of nodes surrounding the node that is a part of transmission or the interference nodes. It can also be stated as number of nodes in the path into average number of surrounding nodes (npath*navg). Also the relation can be studied graphically as EL vs. lt vs. V as shown below.
Fig. 7. Simulink Model of CNT based nano-WSN.
Model of the system in light of recent developments. We have shown that since CNTs which are used in many parts of the sensor nodes, Nano-processors [20], therefore, it is necessary to study the reliability and effect of various parameters on CNT based devices is the motivation behind the work. We have shown the importance of functional CNT and its realistic applications in chemical sensors and other Nano-electronic devices [36]. HPC can be useful for optimization of complex computations which has been shown in [39, 40]. The sensor software has to be modified for CNT specific computations and in case of detection of erroneous readings by the node in CNT based calculations; corrective measures are needed to be incorporated into the software to counter these readings. An algorithm 1 is the algorithm for the functioning of the sensor node:
Algorithm 1. Algorithm for the functioning of the sensor node.
Start Step 1: Input from CNT Sensors Step 2: ADC converters Step 3: Data sent to CNT based Nano-processors Step 4: Computation of data to study the reliability of the signal and the various aspects of occurrence of discrepancy in the readings of the functional CNT sensors End
Modifications needed in current Operating System for CNT based WSN: 1. Minimizing the inconsistency in the readings of CNT sensor nodes due to functional CNTs. 2. Inclusion of correction for the CNT based Nano battery source.
Modeling of CNT based devices in a WSN environment such as CNT Sensors, CNT electronics, CNT-based power sources can be done in this way. Since CNT is the main ingredient of devices, its reliability is of paramount importance. We have corroborated that the reliability of CNT-based sensor node depends upon functionalization of the CNT molecule, application, interconnects and packaging.
VHDL-AMS (VHSIC hardware description language Analog and Mixed-Signal extensions) modeling can be done as substantiated in [26]. The Simulink model shown in Fig. 7. is derived from the various parts of a WSN CNT that has been shown in part II. The programs given in Code 1 and Code 2 are the conversion of the complex mathematical equations into MLATAB format.
Code. 1. Demo code of above Simulink model.
function y = CNT_Sensor() % This block supports the Embedded MATLAB subset, it is used for calculation for equation 6 and equation 7in simulink. dgs =3; di=1g=1;e=1;alpha = 1;h=1;d=1;pi=3.14;k=1;T=1; L=1;epsi=1; dgs= g ( (pow(e,2) * alpha * ln((4*h)/d) ) / (2 * pi * epsi * k * T * ln(10)) ) * (1/L); di=dgs*V
Code. 2. Demo code of above Simulink model.
function y = CNT_Transistor() % This block supports the Embedded MATLAB subset, it is used for calculation for equation 16 and equation 17 in simulink. e = 2.7;h=1;V=1;Vg=1; G = ((4 * (e^2))/h) * (e ^ (-(1/3)* ((V/Vg)^2))); pi=3.14;Eg=1;alpha=1;gamma=1;tox=1; V = (((pi * (Eg^3))/(12 * alpha * gamma))^(1/2)) * (tox^(1/2));
Code. 3. Demo code for distribution of Computation.
Fig. 8. Configuration and status of the HPC setup.
The detailed implementation can be seen in [38]. The configuration of the status of the HPC setup is shown in Fig. 8. Due to symmetry of computation and distributions of various computations on the HPC setup, we got various results. When we fed the reliability computations we got maximum speedup (Fig. 9.), followed by I (current) in various (Fig. 10.), and the least in energy consumptions. Shown below are the speed-up results for various (Fig. 11) calculations that are performed on the HPC set-up in figure 9, 10 and 11. The explanation of the graphs can be predicted from the fact that symmetry of computation and limits used has the most effect on the speed-up. Virtual reality can also be used for taking the analysis in Virtual reality domain with the help of HPC setup.
Fig 9. Speed up which was obtained in reliability computations.
Fig. 10. Speedup in current (I) computations in various parts of the CNT based WSN.
Fig. 11. Minimum speed up obtained in energy consumptions in various parts of a CNT based WSN.
Conclusion
We have shown how novel nanotechnology-enabled devices can be used in a WSN environment. We have addressed the challenges that need to be confronted in CNT based WSN. We have substantiated integration of CNT based devices in WSN including sensors, micro processors, etc. We corroborated the challenges that exist on modeling of CNT based devices for a WSN sensor node and build a reliability model to accurately predict reliability. The modeling of CNT based nodes can be done in packages like Simulink in MATLAB which has been used in this work. We have derived a formulation for energy consumption of CNT based WSN system because energy is the main issue of concern secondly we have derived the reliability equation for the system. Developing a reliability, nano routing and reliability is helpful accelerating time to market for CNT based WSN. Routing plays an important role in CNT based devices where interconnects are very inefficient. Implementation has been done on an HPC setup and comparisons between various calculations have been reported. Control engineering can also play an important role in expanding the work, which is an area of future work. The transmission line equivalent needs to be modified as the new nano scale physics that is currently being developed which is introduced in this paper. To model such systems we have to use complex modeling aspects for which HPC is an eminent need.
Fig. 12. Energy consumption in Nano routing of a CNT based WSN.
Rohit Pathak, Acropolis Institute of Technology & Research, can be reached at [email protected].
Satyadhar Joshi, Shri Vaishnav Institute of Technology & Science, can be contacted at [email protected]
Originally published by Sensors & Transducers Journal (ISSN 1726-5479), Vol. 118, Issue 7, July 2010: Sensor Networks and Wireless Sensor Network. Rohit Pathak, Satyadhar Joshi, Modeling Energy & Reliability of a CNT based WSN on an HPC Setup, Sensors & Transducers, Vol. 118, Issue 7, July 2010, pp.28-45 (http://www.sensorsportal.com/HTML/DIGEST/P_640.htm).
(August 16, 2010) — electronica 2010 will showcase new advanced medical electronics: a prosthetic leg that moves in response to the wearer’s thoughts. The technology was developed by American biophysicist Hugh Herr, a professor at MIT, Freescale Semiconductor and the Fraunhofer Institute for Manufacturing Engineering and Automation IPA.
The technology required to make voluntary control possible is called electromyography (EMG), an experimental method that deals with the generation, recording, and analysis of myoelectric signals. These electrical signals are produced by the change in tension when a muscle contracts. The researchers will demonstrate an EMG pinball machine (electronica Hall A2.221) controlled by muscular tension.
The world need for intelligent prosthetics
For an able-bodied person, walking, running and climbing the stairs are natural movement sequences. For wearers of conventional artificial limbs, every step is often a real effort. They find everyday life challenging because their artificial leg does not always do what they want. Natural movement is something desired by some 100,000 US people a year after losing a leg through amputation.
Medical electronic innovations now offer amputees the hope of recovering near able-bodied functionality. At electronica 2010, the international trade fair for electronics components, systems and applications, exhibitors including Freescale and the Fraunhofer Institute will present innovative components and artificial limbs that simulate the natural movement sequences of the leg.
Naturally moving artificial limbs
"Our aim was to develop a control system that identifies the artificial limb wearer’s desired movement." The key to this innovation is that the voluntary signal is determined in real time. The prosthesis can thus respond to voluntary thoughts and execute the wearer’s wish, explained project manager Alfred von Rosenberg, from the Fraunhofer Institute for Manufacturing Engineering and Automation IPA.
The prosthetic limb incorporates an array of sensors to measure all activity signals from the leg muscles. "So the artificial limb knows whether its wearer is currently standing, walking, sitting or running," added IPA Project Manager Harald von Rosenberg. Pressure sensors that are sandwiched beneath the electronic sensors identify when the amputee shifts their full weight onto the artificial limb. The voluntary control is actuated by EMG.
Intelligent prosthetic leg
Freescale Semiconductor participated in the development of a titanium prosthetic leg which, in conjunction with a robot, simulates the functionality of the real lower leg. The new prosthesis was designed using Freescale components by Dr. Herr, himself a leg amputee following a climbing accident in 1982. In 2011 the company iWalk will start volume production with the prosthetic lower leg PowerFoot One. "When I move my legs in my thoughts, the prosthetic legs move," explained the researcher.
The titanium prosthetic leg imitates natural ankle joints, allowing the artificial foot to be set down, rolled and raised. The robot attached to the artificial lower leg contains five motors and twelve sensors. These include a 3-axis acceleration sensor from Freescale (Hall A6.107). The sensors measure torque, force and speed, converting the readings into motor control commands according to the movement situation. The Freescale sensor is called MMA7361LC and is designed for "low g" movement measurements in wearable applications where only low acceleration forces are encountered. Read more about innovations for prosthetic limbs on ElectroIQ.com here: http://www.electroiq.com/index/search.html?si=eiq+&collection=eiq&keywords=prosthetic
electronica Forum 2010: innovation platform for medical electronics
The future potential of the industry is reflected in numerous applications for highly advanced electronics that appeal to the imagination of consumers and industry in equal measure. As well as intelligent prostheses, companies such as Freescale, Heimann Sensor and EBV Elektronik are showcasing the latest portable medical apparatus such as blood sugar testers and pulse meters, implantable blood pressure sensors and remote monitoring and control systems for pacemakers at the electronica. New developments will be highlighted through presentations and a panel discussion in a session on Thursday, November 11, 2010 at the electronica Forum in Hall A3.
The medical electronics sector is one of the highest-revenue and most innovative development areas of the electronics industry. Jochen Franke, Chairman of the ZVEI Electromedical Technology Professional Association, declared: "The future of the international market for health and medical technology lies in the modernization of the health infrastructure. Medical electronics currently offers the best growth prospects for industrial semiconductors, too. According to the Californian market research institute Databeans, the worldwide segment is growing by as much as 11%. In Germany alone, revenue in 2009 reached USD 1.5 billion (source: ZVEI). Virtually all key innovations in medical technology involve a high level of electronics expertise. Medical technology is thus dependent on intelligent solutions and regular advances from the sphere of electronics, while at the same time stimulating application-oriented research.
electronica is held every two years in Munich and presents innovations from the entire range of products and services in the electronics industry. hybridica, international trade fair for the development and manufacture of metal-plastic hybrid components, has been staged concurrently with electronica since 2008 and produces numerous synergy effects. You can find all information on electronica 2010 at: www.electronica.de/en.
(August 13, 2010) — Cell phones and a slew of emerging devices will power the market for consumer electronics and cell phone Microelectromechanical (MEMS)sensors toward solid, uninterrupted growth in 2010 and beyond, according to the market research firm iSuppli Corp.
Revenue for MEMS sensors and actuators used in consumer electronics and mobile handsets is projected to reach $1.5 billion in 2010, up a solid 22.9% from $1.3 billion last year. “Unlike most industries, the consumer and mobile MEMS market did not suffer a decline last year — even at the height of the global economic downturn — and growth ranging from 17% to as much as 28% will continue during the next four years,” said Jérémie Bouchaud, principal analyst for MEMS and sensors at iSuppli.
Revenue forecast for consumer and mobile MEMS, 2009-2014 (in Billions of U.S. Dollars)
The figure presents iSuppli’s forecast for the consumer and mobile MEMS market from 2009 to the end of the forecast period in 2014.
MEMS sensors and actuators are employed in a variety of additional sectors, including data processing — e.g., printers, projectors, copy machines — automotive, and other high-value markets embracing the industrial, medical, wired communications and aerospace-defense segments.
Nonetheless, consumer and mobile MEMS — already among the largest MEMS markets — are projected to become the biggest MEMS space by 2014. Here, sensors find their way into everyday devices such as laptops, MP3 players, remote controllers and portable navigation devices.
In particular, new consumer products will drive existing and future opportunities, iSuppli believes. The MEMS accelerometers and gyroscopes used for e-books and slate tablets like the iPad from Apple Inc will amount to $105 million in 2014, compared to an almost negligible $3 million in 2009.
Also helping spur expansion of the consumer and mobile MEMS market are various new emerging devices coming into fruition in 2010 and 2011. Among them are 3-axis gyroscopes, pico-projectors, and RF MEMS switches and varactors, iSuppli data show. All told, new MEMS devices will bring an additional $1.3 billion by 2014, up from a mere $33 million in 2009.
Cell phones, however, remain the dominant segment for consumer and mobile MEMS. In 2010, MEMS sensors and actuators in mobile handsets are forecasted to reach $821.4 million, making up 53.1% — well over half—of the market.
Cell phones will continue to be the largest user of consumer and mobile MEMS over the next few years, ahead of consumer projectors, laptops and hard disc drives, game controllers and digital still cameras.
Accelerometers remain the chief MEMS device, netting $557.1 million in revenue for 2010. While their use in gaming controllers and cell phones has either reached saturation or is close to doing so, accelerometers will increase their penetration in laptops and netbooks, and are sure to gain greater exposure in booming categories like e-books and slate tablets.
Other MEMS devices finishing strongly this year, in descending order, are gyroscopes, BAW filters, microphones and MEMS-based displays for projectors.
By 2014, MEMS displays will leap into third place, pushing microphones and BAW filters into the fourth and fifth spots, respectively.
Learn more about the MEMS market with the report from Bouchaud and Dixon, entitled: New Killer Products Keep Consumer MEMS Bubbling. For more information, visit www.isuppli.com.
(August 13, 2010) — Scientists at GE Global Research, GE’s technology development arm, in collaboration with Air Force Research Laboratory, State University at Albany, and University of Exeter, have received a four-year, $6.3 million award from the Defense Advanced Research Projects Agency (DARPA) to develop new bio-inspired nanostructured sensors that would enable faster, more selective detection of dangerous warfare agents and explosives.
Three years ago, GE scientists discovered that nanostructures from wing scales of butterflies exhibited acute chemical sensing properties. (Read a 2007 interview with GE chemist Margaret Blohm here.) Since then, GE scientists have been developing a dynamic, new sensing platform that replicates these unique properties. Recognizing the potential of GE’s sensing technologies for improving homeland protection, DARPA is supporting further research.
Radislav Potyrailo, a principal scientist at GE Global Research and principal investigator, said, “GE’s bio-inspired sensing platform could dramatically increase sensitivity, speed and accuracy for detecting dangerous chemical threats. All of these factors are critical, not only from the standpoint of preventing exposure, but in monitoring an effective medical response if necessary to deal with such threats.”
Potyrailo noted that GE’s sensors can be made in very small sizes, with low production costs. This would allow large volumes of these sensors to be readily produced and deployed wherever needed. Unique sensing properties, combined with the size and production advantages offered by GE’s bio-inspired sensors, could enable an array of other important industrial and healthcare applications, including:
Emissions monitoring at power plants
Food and beverage safety monitoring
Water purification testing for home, environmental and industrial applications
deliver important information about air conditions in localized regions or over large distributed areas. This information can range from warning of impending chemical or health threats to more precisely measuring air quality at a power plant. The unique sensing properties of GE’s bio-inspired sensors provide an opportunity to improve the quality of this sensing data and the ability to collect this data at previously unavailable levels of detail.”
DARPA Program Manager Viktoria Greanya, Ph.D., said: “We have been greatly inspired by examples of naturally occurring optical structures whose properties arise from an intricate morphology. For example, the brilliant colors seen in butterfly wings, beetle carapaces, and peacock feathers are due in large part to their complex structure, not simply their color. DARPA’s goal in this program is to harness the best of nature’s own photonic structures and use advances in materials technology to create controllable photonic devices at visible and near-infrared wavelengths.”
For the DARPA project, GE has assembled a world-class team of collaborators who are recognized experts in their fields. They include: Dr. Helen Ghiradella, from State University at Albany, an expert on the biology of structural color; Dr. Peter Vukusic, from the University of Exeter, an expert on the physics of structural color; Dr. Rajesh Naik, from the Air Force Research Laboratory, with a strong background in bio-inspired functional materials and surface functionalization; and Dr. John Hartley, also from State University at Albany, specializing in advanced lithographic nanofabrication. These team members will complement GE’s strong multidisciplinary team of analytical chemists, material scientists, polymer chemists, optical engineers and nanofabrication engineers who are contributing to development of this new platform.
GE Global Research is the hub of technology development for all of GE’s businesses. Visit GE Global Research on the web at www.ge.com/research. GE is a diversified global infrastructure, finance and media company that is built to meet essential world needs. For more information, visit the company’s Web site at http://www.ge.com
(August 12, 2010) — Emerging Technologies in Healthcare will take place October 27, 2010 at the Electronics Yorkshire Centre, Leeds, UK, LS16 6RF. It will provide networking opportunities for the electronics, regulatory, and medical communities.
Bringing together leaders in electronics, regulatory affairs and medical devices, this event will focus on the growing need for electronics, electronic sensors and wireless technology in medical devices. This event is ideal for product developers, technologists and those involved in R&D; and will provide an invaluable insight into the different perspectives from across the sector.
The Event Emerging Technologies in Healthcare event is organized by Electronics Yorkshire and Medilink Yorkshire & Humber.
(August 12, 2010) — Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting, bonding, sealing and coating. It can be used in various cryogenic applications.
This low-viscosity epoxy with good flow characteristics can be used as a thermally conductive potting compound in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.
EP30FLAO features a service temperature range of 4K to 250ºF. Its thermal conductivity is 9-10 BTU/in/ft²/hr/ºF. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75ºF. It has a low thermal expansion coefficient (CTE), superior dimensional stability, good physical strength and toughness.
Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.
(August 11, 2010) — Automotive electro-mobility will be a central focus of the upcoming electronica show, November 9 to 12, 2010 in Munich, Germany. Organizers have developed a three pillar platform to allow visitors to learn as much as possible about electro-mobility, component technologies and suppy, and companies in the auto sector.
Pillar 1: At the electronica 2010 automotive conference, top managers from the international automobile, automotive component supply and electronics industries will present technologies, solution approaches and strategies to deal with automotive challenges in the coming years. The electronica automotive conference, "electronics meets automotive," begins on Monday, one day before the start of the trade fair, in the Munich International Congress Center. Pillar 2: The exhibition itself will feature a large percentage of automotive companies. Around 20% of exhibitors will present solutions for automobile electronics in the exhibition halls. Pillar 3: On all four days of the trade fair, the Automotive Forum in Hall A6 will feature talks and podium discussions on topics such as power supply or key components in electro-mobility. The conference language is English.
Automotive conference developments and strategies The first day of the conference is aimed, in particular, at top managers from automobile manufacturers, automotive component suppliers and electronics companies. The program will include talks by Brad Maggart, president of Delphi Japan and sales director Delphi Electronics & Safety Asia, on the topic of "Challenges and Opportunities in the Electrification of the China Auto Market." Another talk by Peter Bauer, CEO, Infineon Technologies will discuss "Semiconductors as Innovation Engine for Energy Efficient and Safe Mobility".
Other conference talks will address issues relating to lithium-ion batteries (SB LiMotive) and system architectures for cognitive safety functions (TRW Automotive).
Expert know-how for technical management
The second day of the conference will feature two parallel sessions. It will focus on technologies and will be aimed at technical managers from automobile manufacturers, automotive component suppliers and electronics companies.
The first session will deal exclusively with electro-mobility. The program will include talks by Brose Fahrzeugteile entitled "Energy-Efficient Electromechanical Systems Used in Automotive Applications" and by Volkswagen, "Global Standard Charging Interface for Electric Vehicles."
The second session will examine communication, driver assistance and lighting. BMW will present "IP & Ethernet as Potential Mainstream Automotive Technologies." NXP Semiconductor will present "Driving Innovation in a Green Automotive Industry" and Hella, "Lighting Based Driver Assistance Systems as an Enabler for Future Safety Functions".
Program Committee for the electronica automotive conference The electronica automotive conference program was compiled by a committee whose members include leading experts from international automobile manufacturers, automotive component suppliers and electronics companies:
Dr. Wolfgang Bochtler, Mektec Europa GmbH
Claas Bracklo, BMW AG, Chairman of the Program Committee:
Dr. Heinz-Georg Burghoff, Horegulus Consulting
Richard Espertshuber, Odu Automotive GmbH
Dr. Werner Faber, Epcos AG
Markus Geisenberger, Messe München GmbH
Peter Gresch, Brose Fahrzeugteile GmbH & Co. KG
Jochen Hanebeck, Infineon Technologies AG
Martin Haub, Valeo
Siegfried Hauptenbuchner, KOSTAL Kontakt Systeme GmbH
Dr. Bernd Hense, Daimler AG
Prof. Dr. Günter H. Hertel, European Institute for Postgraduate Education at Dresden Technical University
Prof. Dr.-Ing Gangolf Hirtz, Chemnitz Technical University
Jürgen Höllisch, Elmos Semiconductor AG
Maximilian Huber, Sharp Microelectronics Europe
Helmut Keller, Automotive Electronics Reliability Committee SAE International
Uwe H. Lamann, Leoni AG
Lennart Lundh, Volvo Car Corporation
Nicole Schmitt, Messe München GmbH
Dr. Martin Stark, Freudenberg & Co. KG
Christoph Stoppok, ZVEI e.V.
Dr. Volkmar Tanneberger, Volkswagen AG
Martin Thoone, TRW Automotive/Lucas Automotive GmbH
Johann Weber, Zollner Elektronik AG
Jürgen Weyer, Freescale Halbleiter Deutschland GmbH
electronica, trade fair for electronic components, systems and applications, is held every two years in Munich. Learn more at www.electronica.de
(August 10, 2010) — The Department of Physics and Technology at the University of Bergen, Norway, selected Plasma-Therm 790+ Reactive Ion Etcher for its nano-fabrication facility. The University of Bergen’s system addition to their facility will assist in the development of free-standing Fresnel zoneplates for neutral helium microscopes. The 790+ RIE equipment will also support university work on biophysics experiments in surface engineering and nano-science experiments to test optical and magnetic properties of nanostructures.
“As we move forward with the reach of our experiments, we are constantly searching for reliable, flexible tools that support us in our research and help us push the limits of nano-science. The 790+ system is one of the tools we are using to define the future of nanotechnologies,” said Professor Bodil Holst, Nanoscience Programme Leader at the University of Bergen’s Department of Physics and Technology.
The 790+ RIE provides a flexible technical solution for etching the variety of structures and materials required for advanced research. Simple operation coupled with manual loading on a large electrode addresses the multiple needs of a university operating environment where different substrate sizes and shapes in addition to ease of use by multiple users is key. “The increased area of the 790+ electrode increases uniformity and throughput while maintaining affordability for both university and production settings,” said Ed Ostan, executive vice president of sales & marketing at Plasma-Therm.
Plasma-Therm is a supplier of advanced plasma process equipment that focuses on various specialty markets including photomask, solid state lighting, thin film head and compound semiconductors. Learn more at www.plasmatherm.com
The University of Bergen, located in Bergen, Norway, is a research university emphasizing basic research, research-based teaching, and the development of academic disciplines. The Faculty of Mathematics and Natural Sciences is one of six faculties at the University of Bergen and has around 2700 students. The Faculty consists of eight departments, including the Department of Physics and Technology, which provide the foundations for its teaching and research activities.
August 9, 2010 – Business execution, and not so much technological differentiation, separates the pack among firms developing nanotechnology-enabled batteries, according to a new report from Lux Research.
Promise and potential for energy storage has attracted a number of firms, many of which are basing their work on nanomaterials such as lithium titanate and lithium iron phosphate nanoparticles with battery electrodes. But there is "little technological differentiation between firms targeting this segment," says Jurron Bradley, senior analyst with Lux Research, in a new report.
A123 Systems, for example, isn’t the only one who makes nanostructured lithium iron phosphate battery electrodes (target market: automotive), but it shines due to what he calls "solid business execution" — it was the only nanotech company to go public in 2009, and one of the year’s most successful IPOs in any tech category.
Others in the mix for the nanotech battery sector (see Bradley’s quadrated grid, below):
– Electrovaya. The company scored highest in "technical value" according to Bradley’s criteria, developing nanostructured polymer electrolytes for several types of battery cathodes. It also has a "relatively strong" revenue to employee calculation of >$41,000, as well as "a strong partnership list" that includes Tata Motors.
– K2 Energy Solutions. Bradley puts K2 in the "long shot" category. Despite recent development deals (e.g. a $30M Chinese JV and an undisclosed deal for scooters/bikes/etc.), this company has yet to land a significant partner in the "lucrative" automotive market, he points out.
– Altair Nanotechnologies. This company’s star has lost some luster — it’s 1Q cash burn rate was 5× its 2009 annual revenues, and its stock price hasn’t sniffed the Nasdaq-required $1 mark since late 2009 (it’s currently languishing around $0.40). At this point, Bradley says, one could also call ALTI another "long shot."