08/24/2011 

The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.

08/23/2011 

Assembl

08/23/2011 

SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) honored its top materials and equipment suppliers in 2010, recognizing "intense focus and commitment to performance, quality, cycle time, and cost."

08/22/2011 

National Instruments (Nasdaq: NATI) added per-pin parametric measurement unit modules and source measure unit modules to its PXI platform for semiconductor characterization and production test.

08/22/2011 

Semiconductor packaging and test provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) welcomed Pasquale Pistorio as an advisor to its Board of Directors.

08/19/2011 

Compugraphics International is widening its line of photomasks to include larger-area products up to 16 in², responding to customer demand for wafer-level packaging and other semiconductor and optical applications.

08/17/2011 

The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."

08/17/2011 

Nemotek Technologie uncrated the Exiguus, with a VGA wafer-level camera integrating wafer-level optics assembled with CMOS image sensors (CIS).

08/15/2011 

Johnstech International Corporation is rereleasing the configurable ROL 200K (Kelvin) Test Contactor as the ROL 200KR Kelvin-Ready Test Contactor for both pad and leaded style devices.

08/15/2011 

Tessera Technologies appointed Anthony J. Tether, Ph.D., to its board of directors. Tether is CEO of The Sequoia Group, and has held executive positions at DARPA and Ford Aerospace Corp., among others.

08/12/2011 

SEMI will hold the first-ever SiP Global Summit, September 7-9, co-located with SEMICON Taiwan. Three forums cover system in package (SiP) test, the "3D IC era," and the requirements of mobile electronics.

08/11/2011 

Nordson MARCH and Science College of Donghua University, Shanghai, China launched a joint laboratory for plasma research and education. The college and supplier will share equipment, research projects, personnel resources, and additional resources as needed.

08/10/2011 

Amkor's Ron Huemoeller shares his thoughts about two panels from SEMICON West, on 2.5D silicon interposer packaging technologies and its supply chain, and 3D packaging technology and its ecosystem.

08/10/2011 

The University of Waterloo, Ontario, through the Applied Research and Commercialization Initiative, is supporting several companies researching and developing new products. One company receiving aid from the school is Microbonds, maker of semiconductor bonding wire.

08/10/2011 

Multitest launched a 16-site tri-temp pick-and-place handler, the MT9510 x16. The platform can be kitted to test a range of semiconductor packages.

08/09/2011 

Amkor has extended its Quad Flat No-Lead (QFN) package design kit to be the first such kit available for Agilent Technologies' Advanced Design System (ADS) electronic design automation software.

08/08/2011 

Industry efforts to transition from gold to copper wire are accelerating as prices for gold continue to spike to near record levels, notes TechSearch International in a new report.

08/07/2011 

Nomura Principal Finance Co. Ltd., a wholly owned subsidiary of Nomura Holdings Inc., transferred all the shares it owns in Eastern Co. Ltd. to Eastern.

08/04/2011 

LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.

08/04/2011 

Apple Inc.'s iPad has thus far thwarted competitive tablets in design efficiency, according to an IHS iSuppli Teardown Analysis of eight tablet models from IHS. Major savings come from Apple's control of chips like SDRAM and applications processors.