|
|
WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Sponsored By:
Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
Sponsored By:
More Webcasts
|
Sonix Inc. introduced its Molded Flip Chip Imaging (MFCI) enhancement. Sonix MFCI improves image quality and defect detection in molded flip chips and packages with polyimide (PI) layers.
T.Onishi, Grand Joint Tech and E.J. Vardaman, TechSearch International share the highlights on low-k dielectrics, 3D packaging, copper pillar, and other exciting work presented at the International Conference on Electronics Packaging (ICEP) in Japan.
New work from Stanford goes beyond simple bump shear testing to allow simulation of stresses exerted on chips during semiconductor packaging. The researchers are able to explore how the stresses affect back-end structures. Alex Hsing, a PhD student in Professor Reinhold Dauskardt's Group at Stanford University, summarizes the group's approach.
Questar Products International released the Q7000 series of fine-pitch, fine-wire (17-75μm), aluminum/gold (Al/Au) automatic wedge and ball bonders to better meet smaller lot size, multiple product variation, frequent set-up change styles of package production.
Sonoscan has demonstrated the single-scan imaging of a sample at 50 different depths, or gates, a technique called PolyGate. It reveals how features, including defects, change from one gate to the next.
Yole reports on the flip chip market, and finds that this $16 billion industry, with diverse applications, is still growing. New flip chip technologies, such as copper pillars, and technology demands, such as fragile 28nm chips, are driving demand.
Advanced Thermal Solutions, ATS, has released the iQ-200 thermal analysis system for precisely and simultaneously measuring the temperatures of solid materials and the surrounding air, as well as tracking air velocity and air pressure at multiple points to comprehensively profile heat sinks, components, and PCBs.
Zymet Inc. introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. The adhesive can prevent pad damage during BGA rework, particularly with fine-pitch BGAs.
Keithley Instruments Inc., advanced electrical test instruments and systems provider, introduced the Model 2651A High Power System SourceMeter instrument to characterize high-power electronics, like HB-LEDs, power semiconductors, DC-DC converters, batteries, etc.