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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Alan Huffman, research engineer and program manager at RTI International, presented a paper at IMAPS 2010 titled "On the origins, status, and future of flip-chip and wafer-level packaging." In a podcast interview with Debra Vogler, senior technical editor, Huffman discusses the advantages and disadvantages of flip-chip and wafer-level packaging (WLP), along with potential solutions.
Bare die in yarn, comfortable electronics, stretchable interposers, washable photovoltaic clothes, and other elements will be on the table for the PASTA project to bring smart textiles from the lab to industrial manufacturability. Imec leads the program.
NXP SOD882D enables easy visual inspection of solder pads. SOD882D is an ultra small and flat package built for space constrained and robust devices. The new package pad designs were developed out of NXP's discrete leadless packaging technologies.
Andrew Smith, Ventmark Technology Solutions, presents a 3D die stacking technology to address package miniaturization. Using bare die and vertical interconnect structures, this stacking technology permits the design of ultra-thin, near-CSP solutions without TSVs. Designers lacking custom ICs should look to new chip stacking technology.
Wolfson Microelectronics plc (LSE: WLF.L) launched its next-generation digital silicon micro-electro-mechanical-systems (MEMS) microphones, the WM7210 and the WM7220. The digital MEMS are manufactured with Wolfson’s CMOS/MEMS membrane technology.
DEK has teamed up with Irisys, infrared products supplier, to develop a robust fine-pitch isotropic conductive adhesive (ICA) interconnection process designed to drive Irisys’ latest generation of advanced infrared sensor products. The project led to the development of an optimized process for the assembly of pyroelectric thermal sensing arrays.
X-RAY WorX presented its new concepts for the cooling of high resolution microfocus X-ray tubes. The company offers a new, modular cooling concept with an optimized internal cooling of the target inside the tube head.
SET unveiled a patented system enabling a thorough removal of oxides before or during the semiconductor packaging bonding sequence. Addressing the challenges of the oxidation of metal surfaces in device bonding, this machine system encompasses a substrate chuck and a bond head with a non-contact localized confinement chamber that operates safely with reducing gases such as forming gas or formic acid vapor.