3D Integration

3D INTEGRATION ARTICLES


MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel

04/05/2012 

MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.
Georgia Tech increases interposer development work

04/04/2012 

Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging.
Amkor licenses 3D packaging tech to SHINKO

03/30/2012 

Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology.
Synopsys launches 3D packaging EDA line-up

03/26/2012 

Synopsys is combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging. The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive EDA solution.
SEMICON Europa 2012 seeks presenters

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Apple A5X processor teardown: Bigger die, higher heat?

03/22/2012 

Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.
Taiwan allows higher Chinese investments in LCDs, semiconductors, fab equipment, more

03/21/2012 

Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
Fraunhofer delivers 300mm wafer processing to North America with Axus Technology

03/21/2012 

Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.
Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch

03/20/2012 

Imec developed a via-middle approach to through-silicon via (TSV) manufacturing for 3D packaging, using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer.
Amkor (AMKR) names Taiwan leader with semiconductor packaging background

03/16/2012 

Amkor Technology Inc. (Nasdaq: AMKR) added Mike Liang as president of Amkor Technology Taiwan. Liang's background includes stints with Phoenix Semiconductor, Ti-Acer, UMC, and others.
Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

03/15/2012 

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

Shin-Etsu Chemical joins EVG wafer bonding supply chain

03/14/2012 

EV Group (EVG) welcomed Shin-Etsu Chemical  into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.

Interposer supply/ecosystem examined at IMAPS Device Packaging

03/12/2012 

Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.
AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab

03/07/2012 

Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore
STATS ChipPAC brings FOWLP to stacked packages for <1mm profile

03/06/2012 

STATS ChipPAC Ltd. (SGX-ST:STATSChP) uncrated its next-generation eWLB package-on-package (PoP) technology, with a package profile height below 1.0mm.
AMAT, A*STAR Advanced Packaging Centre of Excellence plans grand opening

03/01/2012 

Applied Materials and Singapore's A*STAR Institute of Microelectronics will officially open the Centre of Excellence in Advanced Packaging, in Singapore
SEMICON China: Challenges and opportunities for semiconductors, emerging techs

02/23/2012 

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more

02/22/2012 

International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.
Present at ESTC 2012 in Amsterdam

02/21/2012 

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
Semiconductor industry expectations for 2012: Take the WWK survey

02/17/2012 

Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.



WEBCASTS


Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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