07/13/2011 

Stanley T. Myers talks what moments stand out for him as "historic" advances in semiconductor fab and the evolution of SEMI. He also shares advice for young engineers entering the semiconductor industry.

07/11/2011 

At SEMICON West, imec is demonstrating a viable implant-free quantum-well (IF-QW) pFETs with an embedded silicon-germanium (SiGe) source/drain and 3D integration of a commercial DRAM chip on top of a logic IC.

07/06/2011 

Solid State Technology and SEMI today announced the finalists for the 2011

07/06/2011 

EV Group will contribute its know-how and technology in temporary bonding and debonding, chip-to-wafer bonding, and lithography technology to the Georgia Tech's PRC's Silicon and Glass Interposer Industry (SiGI) Consortium research program.

07/05/2011 

Elpida Memory is now sampling a new 8Gb TSV DRAM consisting of four 2Gb layers based on TSV stacking technology.

06/28/2011 

At CEA-Leti's Annual Review, Leti CEO Laurent Malier noted how the important role that research and technology organizations should play in strengthening industry in Europe, and how their roles differ from groups in other regions.

06/24/2011 

SEMICON West preview: This year's SEMICON West Advanced Packaging Program is taking a broad approach, encouraging participation from across the supply chain to help keep pace with a rapidly expanding electronics market -- and in markets beyond, from automotive to aerospace and medical.

06/20/2011 

A standing-room crowd gathered at SEMI for a special NCCAVS usergroup meeting to hear about issues relevant to 3D packaging, including CMP for through-silicon vias (TSV), a DFM methodology for 3D TSV packaging designs, and TSV process integration challenges.

06/16/2011 

Mentor Graphics Corporation (NASDAQ:MENT), in a cooperative effort with Tezzaron Semiconductor and MOSIS, created a process for economically developing and manufacturing 3D-IC prototypes on multi-project wafers (MPWs).

06/13/2011 

FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.

06/06/2011 

Imec and Cadence say they have developed a design-for-test and automatic test pattern generation technology to more easily test 3D stacked ICs with through-silicon via (TSV) functionality, adding only "negligible" area costs.

06/01/2011 

Updating on plans announced a year ago, Elpida, Powertech, and UMC say they have finalized their partnership to develop a "one-chip" logic+DRAM 3D IC solution incorporating 28nm interface design, through-silicon via (TSV) formation, wafer thinning, testing, and chip stacking assembly.

06/01/2011  Silicon interposers seem set to stay as a valid alternative implementation to full 3D-IC designs. Matthew Hogan, Mentor Graphics, Wilsonville, OR

05/31/2011 

STATS ChipPAC says integrating through-silicon vias with passive devices and its eWLB technology addresses complex design issues, shrinking lithography nodes, and increased performance demands for mobile and consumer applications.

05/26/2011 

Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology. Challenges arise in measuring such small bumps used in advanced packages, including efficiently handling huge amounts of data.

05/26/2011 

Ivo Bolsens, Xilinx, compares crossover cars -- sports car performance with station wagon utility -- to semiconductor ASICs (high-performance) and FPGAs (flexible, easy to use, less NRE). The semiconductor industry needs a programmable platform that has ASICs' capabilities.

05/25/2011 

imec's 3D integration industrial affiliation program (IIAP) partnered with Atrenta Inc., SoC realization products provider to semiconductor and electronic systems industries, to developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs.

05/25/2011 

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Here, Jan Provoost looks at Pol Marchal's presentation on 3D integration and its impact on systems design -- and why sensors that smell are coming next.

05/23/2011 

05/23/2011 

Amkor Technology (NASDAQ:AMKR) completed its offering of $400 million aggregate principal amount of its 6.625% Senior Notes due 2021. The proceeds from the offering will be used to fund the company's tender offer for the approximately $264.3 million aggregate principal amount of its outstanding 9.25% Senior Notes due 2016, for general corporate purposes.