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Think Tank
Think TANK
Tom bought black and white tiles, 12 x 12-inches each, to lay on his square patio deck. He planned to have a perfect square of black tiles in the center of the deck with a border of white tiles around it
News
Kyocera combines copper conductors and alumina ceramic
Kyocera Corp. has developed a new ceramic packaging technology that combines features of low-temperature co-fired ceramics (LTCC) with tradition alumina ceramics.
News
Database for die products
To assist design engineers working with bare die, the Die Products Consortium (DPC) has created a database of information on available die products
News
Shake-up in probe card suppliers
There was significant motion in the ranking of probe card suppliers in 2001, according to a report from VLSI Research Inc
News
Wafer handling partnership for Adept and DEK
Adept Technology and DEK have announced a partnership to develop a fully automated wafer handling system for DEK's screen printer wafer bumping and ball placement system
News
STATS licenses ITRI Technology, introduces new PBGA
ST Assembly and Test Services (STATS) has licensed a heat dissipation technology developed and patented by the Industrial Technology Research Institute (ITRI)
News
China update: K&S, Intel making progress
Intel has announced plans for a $100 million expansion of its Pentium 4 assembly and test facilities in Shanghai. It reported that work would be completed on the plant this year, as part of a $500 million investment in facilities in China
News
Novel processes at IMAPS Garden State symposium
The Garden State Chapter of the International Microelectronics and Packaging Society (IMAPS) held its Spring Packaging Symposium in May where companies provided the latest updates on their new advanced packaging technologies
Feature Products
Semicon West Products
For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.
News
Advanced Packaging added to Chemical Abstracts Service
The American Chemical Society has selected Advanced Packaging for inclusion in its Chemical Abstracts Service (CAS)
News
MEPTEC optoelectronics update
MEPTEC held its second optoelectronics symposium in April. The symposium, entitled "The Opto-Mystic Industry," had a smaller crowd than last year's standing-room-only event.
News
CSPs, stacked packaging proliferate
Several announcements by major semiconductor manufacturers indicate the extent to which advanced packaging technologies have permeated mainstream products
News
UTAC establishes US design center
United Test and Assembly Center (UTAC) is setting up a package design center in Pleasanton, Calif., to support the design needs of customers in North America
Editorial
Packaging defines products
Last month I had the good fortune to have a lengthy chat with the leadership of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society during ECTC
Industry Voices
Understanding the value of patents
Patents are becoming increasingly important to the electronics packaging industry. The number of patents in new packaging technology is growing by more than 40 percent per year
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