FREMONT, Calif.—August 1, 2000—Designed to expand its process control metrology systems business, Therma-Wave unveiled new products for use in metrology for metal films, critical dimension metrology, and a line of integrated metrology systems.
By pennNET Staff
FREMONT, Calif.—July 25, 2000—Therma-Wave Inc. will develop and supply advanced metrology solutions for integration with Applied Materials' process systems and modules.
By Michael Sciannamea
By Jason Rothman
SEMICON West ’00—July 14,2000—Semitool’s Paragon line of electrochemical deposition tools will include Royal Phillips Electronics new integrated metal-film metrology system, say the companies.
The collaboration arose to address the industry’s need for tools guaranteed to operate well together, eliminating one issue facing customers moving to 300mm. “Semitool has come up with a proprietary process to repair the seed layer before they put the ECD plating over it,” says Bill Gately, General Manager for Phillips Analytical in Boston. “In order to properly do that they need [metrology] within their tool to measure the seed layer when it comes into the tool so they know first whether it needs to be repaired and second how it needs to be repaired,” he says.
He added that Phillips already works with Novellus and Applied Materials and that Phillips suggested a stand-alone box to measure the wafers. Semitool suggested combining the two tools to simplify the process.
The new combined system first measures the seed layer of incoming wafers. It shoots a nanosecond laser pulse onto the wafer’s coating, creating an acoustic wave that moves across the wafer like throwing a stone into water, according to Dr. Tom Ryan, a Product Marketing Manager for Phillips. Then a probe laser measures the wave’s velocity. A computer then reads the information and a robot arm takes the wafer either to the ECD plating stage or it sends it back to repair the seed layer.
“We would like to become the standard metrology that can be utilized as a common link to all these processes,” Gately said. “We view this as a first step in a strategic direction we are heading in,” he says.
SEMICON West '00—July 12, 2000—In San Jose, Cal., today, Teradyne Inc. introduced a VLSI test system that the company says will allow a full range of test capability without requiring hardware changes or system upgrades.
By Jason Rothman
SEMICON West ’00—July 14,2000—Semitool’s Paragon line of electrochemical deposition tools will include Royal Phillips Electronics new integrated metal-film metrology system, say the companies.
The collaboration arose to address the industry’s need for tools guaranteed to operate well together, eliminating one issue facing customers moving to 300mm. “Semitool has come up with a proprietary process to repair the seed layer before they put the ECD plating over it,” says Bill Gately, General Manager for Phillips Analytical in Boston. “In order to properly do that they need [metrology] within their tool to measure the seed layer when it comes into the tool so they know first whether it needs to be repaired and second how it needs to be repaired,” he says.
He added that Phillips already works with Novellus and Applied Materials and that Phillips suggested a stand-alone box to measure the wafers. Semitool suggested combining the two tools to simplify the process.
The new combined system first measures the seed layer of incoming wafers. It shoots a nanosecond laser pulse onto the wafer’s coating, creating an acoustic wave that moves across the wafer like throwing a stone into water, according to Dr. Tom Ryan, a Product Marketing Manager for Phillips. Then a probe laser measures the wave’s velocity. A computer then reads the information and a robot arm takes the wafer either to the ECD plating stage or it sends it back to repair the seed layer.
“We would like to become the standard metrology that can be utilized as a common link to all these processes,” Gately said. “We view this as a first step in a strategic direction we are heading in,” he says.
SEMICON West '00—July 12, 2000—Boxer Cross unveiled a new metrology solution today in San Francisco, Calif. at the company's private exhibit at Zeum, the new art and technology center.
By Stephanie J. Levy
SEMICON West '00.—July 10, 2000—In San Francisco, Calif. today, Schlumberger Semiconductor Solutions introduced the next evolution of its sub-micron metrology tool, the IVS 135.
By pennNET staff
The NanoSpec 9100 is a new addition to the company's NanoSpec 9000 line. This announcement follows those of the N2000, 9200, and 9300 film metrology systems. The 9100 is a standalone film metrology system with deep-ultraviolet (DUV) to near-infrared spectroscopic ellipsometry, DUV to visible reflectometry, and Fourier transform infrared (FTIR) technology.
By pennNET staff
GENEVA, Swizerland—July 7, 2000—STMicroelectronics has announced that it will team with Nortel to develop optical network technology.
Sunnyvale, CA—July 7, 2000—Nanometrics Inc. introduced the NanoSpec 9100, an automated, non-contact film metrology system designed to measure films on substrates used in wireless, optical telecommunication integrated circuit manufacturing and other semiconductor devices.
SAN JOSE, Calif.—June 30, 2000—KLA-Tencor Corp. has introduced a new generation of in-line CD scanning electron microscopes (SEMs) for next-generation lithography and etch applications. The tools are designed for use as a fab transitions to 0.13-µm node and 300-mm manufacturing.
By pennNET Staff
MUNICH, Germany and SOUTHBOROUGH, Mass.—June 28, 2000—Karl Suss has announced a new tool capable of measuring thick and thin films used in a wide range of applications. The company manufactures equipment and process technology for the micrelectromechanical systems (MEMS), microelectronics, and semiconductor markets.
By Stephanie J. Levy