Tag Archives: strategy

Andy Grove blessed us all

andrew-grove_1-150x150Andy Grove, the man who codified the commercial IC industry dynamic as “Only the Paranoid Survive” died yesterday at the age of 79. His instinctive paranoia derived from his tragic experiences while growing up in Hungary, as referenced by Wikipedia in the prolog to “Swimming Across: a Memoir”:

By the time I was twenty, I had lived through a Hungarian Fascist dictatorship, German military occupation, the Nazis’ “Final Solution,” the siege of Budapest by the Soviet Red Army, a period of chaotic democracy in the years immediately after the war, a variety of repressive Communist regimes, and a popular uprising that was put down at gunpoint. . . [where] many young people were killed; countless others were interned. Some two hundred thousand Hungarians escaped to the West. I was one of them.

Grove was responsible for guiding Intel in the 1980s through the amazingly risky yet ultimately wildly successful strategy of abandoning memory chip production as part of a diversified product portfolio to “bet the company” on microprocessors. In the September 1997 issue of Solid State Technology, I wrote an article titled “DRAM fab strategies in Asia” that summarizes why and how US companies like Intel strategically abandoned DRAM production:

In the 1960s, US companies created the IC manufacturing industry and enjoyed virtually unchallenged world dominance through the 1970s. Japanese IC companies, though at first the junior companies in low-margin and foundry partnerships, rose to challenge the more senior US companies in the 1980s. By the latter half of the 1980s, Japan effectively owned the DRAM business and Japan`s outstanding success in IC production can be directly traced to early US manufacturing partnerships. One strategy played out by US companies with portfolios of memory chip designs was outsourcing of DRAM production to Korean companies. In so doing, US companies committed their futures to non-DRAM products such as microprocessors, DSPs, and ASICs.

Few executives have sufficient vision while leading a work-force with sufficient discipline to be able to re-invent a company in such a way. The capital equipment investments needed to create a leading-edge IC fab have always been daunting, and as Intel employee #3 who had led engineering Grove was able to see a way to leverage strategic R&D to ensure that leading-edge IC product functionalities would pull in sufficient demand to keep the fabs full. Not only did the fabs stay full, but the x86 microprocessor profit margins allowed Intel to grow to annual sales of $25 billion by the time he was replaced as CEO by Craig Barrett in 1998.

The San Jose Mercury News and EETimes have published wonderful additional remembrances of his life. Andy Grove blessed our industry by being a living example of engineering excellence and legit leadership.

—E.K.

Apple Fab Speculation

Apple Corp. recent purchased an old 200mm-diameter silicon wafer fab in San Jose capable of creating as small as 90nm device features. Formerly owned and operated by Maxim, the US$18.2M purchase reportedly includes nearly 200 working fab tools. Some people outside the industry have speculated that Apple might use this fab to do R&D on the A10 or other advanced logic chips, but this old tool-set is completely incapable of working on <45nm device features so it’s useless for logic R&D.

As reported at EETimes, this old fab could be used for the R&D of “mixed-signal devices, MEMS and image sensors and for work on packaging.” Those who know do not speak, while those who speak do not know…I do not know so I’m free to join the public speculation. Mixed-signal and MEMS processing would require major re-tooling of the line, but this 15-20 year-old tool-set is nearly turn-key for wafer-level packaging (WLP). With minimal re-tooling, this line could produce through-silicon vias (TSV) or through-mold vias (TMV) as part of Fan-Out WLP (FO-WLP).

Our friends at ChipWorks have published a detailed tear-down analysis of the System-in-Package (SiP) used in the first generation Apple Watch; it contains 30 ICs and many discretes connected by a 4-layer printed circuit board (PCB). Significant power and performance improvements in mobile devices derive from stacking chips in such dense packages, and even greater improvements can found in replacing the PCB with a silicon interposer. With Apple pushing the limits on integrating new functionalities into all manner of mobile devices, it would be strategic to invest in WLP R&D in support of application-specific SiP design.

—E.K.

Silex’ Strategic Acquisition by China

A secretive investment holding company out of Hong Kong named GAE Ltd has acquired 98% of the shares in Silex Microsystems AB (Jarfalla, Sweden). The transaction took place on July 13th of this year when the former major shareholders agreed to sell all of their respective holdings, while Silex founder and CEO Edvard Kalvesten retains 2% of the shares in the company and continues his role as CEO and board member of Silex. No changes are made to the organizational structure or business operations of Silex, while the new owners plan to build a new high-volume manufacturing line near Beijing that clones the equipment and processes in Sweden with first wafers out by mid-2017 (as reported at EETimes).

Silex claims to be the “world’s number one Pure Play MEMS Foundry”, has worked with AMFitzgerald&Assoc. on RocketMEMS shuttle wafers to reduce MEMS development time by 6-12 months, and has developed multiple Through-Silicon Via (TSV) technologies to allow for efficient 3D integration of MEMS and CMOS.

Almost lost as a footnote in the news is that Silex holds IP on lead-zirconium-titanate (PZT) thin-film technology that allows for efficient piezo-electric energy-harvesting chips. MicroGen Systems is currently in the market with aluminum-nitride (AlN) piezo-cantilever micro-power generator system to power IoT nodes by scavenging either single-frequency or multi-frequency vibrations, working with X-Fab in Germany as foundry partner. If PZT-based piezo-cantilever energy harvesters can compete with AlN-based devices then the former could constitute much of the product volume in the new Silex Beijing fab. In 2014, Yole Developpement forecast “the integration of IoT-dedicated electronic components to result in a market volume of 2B units for these devices by 2021;” if 30% will use energy harvesting then this represents 600M units globally.

—E.K.