Table of Contents

Solid State Technology

Year 2007
Issue 1



Merger Consolidates Prototyping Services

PLANO, TX - A merger between CV Inc. Business Solutions, FIB-X, Microtech Analytical Labs LP (MAL), and Fast Semiconductor, Inc. (FAST Semi), has created a full-scale prototyping house for chip-scale, flip chip, BGA, and QFN packages, with bumping and wire-bonding, assembly, failure analysis, design debug, and other packaging services.


Dresden Factory Aims to Commercialize e-Reading

CAMBRIDGE, U.K. - Plastic Logic, which produces plastic substrates, garnered funding from a variety of equity sources to open a factory for commercial production of plastic electronics, specifically, the flexible active-matrix display modules of electronic readers.


Proposed Consortium Seeks to Improve TIMs

BINGHAMTON, NY and ATLANTA - The Packaging Research Center (PRC) at the Georgia Institute of Technology (Georgia Tech) in Atlanta is partnering with Binghamton University, NY, to develop and promote a possible industry consortium addressing thermal interface materials (TIMs).


CoorsTek Acquires Ceramic Wire-bond Company

GOLDEN, CO - Ceramics supplier and component manufacturer CoorsTek, acquired Gaiser Tool Company (Ventura, CA), a precision-tooling manufacturer of ceramic capillaries for high-reliability wire bonds.


Connector Company Acquires Packaging Technology

PARIS - Souriau S.A.S., controlled by Sagard Private Equity Partners, signed a binding agreement to acquire U.S. operations of Pacific Aerospace & Electronics Inc. (PA&E).


Endicott Interconnect Appoints Director for Global Accounts

ENDICOTT, NY - Warren Dannelly became director of sales, global accounts, for Endicott Interconnect Technologies, Inc., reporting to Michael Hills, senior VP of account services.


Report: RFID - A Tale of Four Continents

CAMBRIDGE, U.K. - Reporting on the usage and volume of radio-frequency identification (RFID) tags, IDTechEx’s “RFID - A Tale of Four Continents,” examines data from North America, East Asia, Europe, and Australasia. IDTechEx found North America to be the largest RFID market in value, tag volume, and case studies, with the U.S. being the primary driver.


Datacon Appoints India Rep

Datacon Technology GmbH named H. Fillunger & Co., Pvt. Ltd., sales representative in India. H. Fillunger, headquartered in Pune, India, also operates in Mumbai, an industrial center; Bangalore; and New Delhi, the capital. Datacon noted that the country’s market for electronics manufacturing equipment is rapidly expanding.


APEX Commemorates 50 Years of IPC

LOS ANGELES - IPC Printed Circuits Expo/APEX/Designers Summit, February 18-22 in Los Angeles, will host the 50th anniversary celebration of the IPC - Association Connecting Electronic Industries, as well as various other celebratory and informative events.


USDC Promotes FPO Adoption

SAN JOSE, CA - The U.S. Display Consortium (USDC) board of directors will launch an initiative to promote flexible, printed, and organic (FPO) electronics, providing services to industry, academia, and government sectors with the aim of developing and expanding the FPO electronics sector and drafting a pertinent technology roadmap.

New Products


A computerized tomography (CT) capability, XXX, generates a 3-D image of an object from a series of 2-D images captured on a single axis of rotation.

Editorial Board

The Times, They Are A-changin’

The times, they are a-changin’ - Bob Dylan famously announced in 1964, creaing an anthem for America’s social revolution in the 1960s.

Industry Voices

Fostering Innovation Through Academia Collaboration

Continuous innovation is key to future survival and growth of businesses operating in increasingly competitive global markets.

Notable Developments

Compact All-optical Buffers on a Silicon Chip

he use of light signals to connect different chips within a computer or different parts within a chip has attracted lots of attention due to the huge bandwidth provided by optics.

Advanced Packaging Road

In Uncharted Territory

1. Touring the NEXX System facilities are, from left to right, Gail Flower, editor-in-chief; Stan Piekos, VP finance; Meredith Courtemanche, assistant editor; Arthur Keigler, VP technology; Diane Donnelly, AP national sales manager; Dick Post, CEO; and Françoise von Trapp, managing editor.


The Heat Is On

Playing golf has taught me a bit about work under pressure. I wouldn’t say that my golf game is bad, but if I grew tomatoes, they would probably come up sliced.


The Back End Process

Methodology and Flow Challenges in Multi-die Package Design

Technology shifts in consumer electronics present manufacturers with a laundry list of challenges.

3 D Stacking

Micro-contact CSP

Many of today’s advanced packages use solder ball contact arrays to make package-to-board or package-to-package level 2 electrical connections.

Wafer Bumping

Fluxless Wafer Bumping by Electron Attachment

One of the keys to successful wafer bumping is the removal of surface oxides on the deposited solder during reflow, usually done by using organic fluxes.


Particle Atomic Layer Deposition

Increasing miniaturization and circuit density is an ongoing trend in electronics.

Cover Story

2007: Packaging Saves the World

Perhaps for the first time in electronics, packaging has come into its own. As you read this forecast for 2007, you will notice a new attitude filled with confidence and enthusiasm.