Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES


MHI room-temp wafer bonder line grows with 300mm tool

01/16/2012 

Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.
Zymet PoP underfill offers lower viscosity, CTE for finer pitches

01/11/2012 

Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.
Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters

01/10/2012 

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
UltraFlat wafer-level semiconductor test process creates permanent PCB flatness

01/09/2012 

Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.
Camtek launches TEM for advanced semiconductor makers

01/09/2012 

Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
Hesse & Knipps heavy wire bonder handles power semis

01/06/2012 

Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.
Advantest to expand beyond semiconductor test

01/05/2012 

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
PTI buys NEXX deposition tool for RDL and Cu pillar fab

01/03/2012 

NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.
22nm requires foundry-to-packaging-house cooperation

12/30/2011 

At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
IEST cleanroom apparel doc update includes measurement guide

12/29/2011 

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
Newport to buy photonics test tool maker

12/28/2011 

Newport Corporation (NASDAQ:NEWP) will acquire ILX Lightwave Corporation, which makes high-performance test and measurement products for laser diodes and other photonics components. Newport will pay $9.3 million in cash.
AVX eliminates conflict tantalum

12/21/2011 

AVX Corporation has ensured that all its tantalum powder and wire suppliers are fully compliant with the independently audited Conflict-Free Smelter Program (CFS).
High-temp area-array package test sockets suit military, geophysical apps

12/20/2011 

Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200
Copper wire bonding offered from Quik-Pak

12/16/2011 

Quik-Pak, a division of Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa (K&S) Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper.
Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness

12/15/2011 

CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for hands-off 300mm handling and bond shear inspection.
Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

12/14/2011 

Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.
ST eliminates wafer probes for on-wafer die test

12/14/2011 

inTEST to acquire Thermonics division of Test Enterprises

12/13/2011 

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management

12/12/2011 

Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.
MX's RDL, copper wire bonding processes take aim at packaging costs

12/12/2011 

MagnaChip Semiconductor Corporation now offers a redistribution layer (RDL) metal process for wafer bumping and an I/O structure and process that is fully compatible with copper wire bonding, reducing packaging costs.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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