11/11/2011 

Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.

11/10/2011 

LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.

11/08/2011 

Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing functionalities into the package substrate.

11/08/2011 

PVA is introducing the PVA6000 flexible coating and dispensing tool with new features based on customer feedback to improve accessibility for maintenance and improve ease of use.

11/04/2011  Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.

11/04/2011 

Amkor will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years.

11/04/2011 

Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson's name with the IMAPS Educational Foundation.

11/04/2011 

Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.

11/03/2011 

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.

11/03/2011 

Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, for substrates, materials, and equipment.

11/02/2011 

Henkel will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany.  The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high T_g.

11/02/2011 

Henkel will launch several new electronics assembly materials at Productronica. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.

11/01/2011 

ATMI has taken control of, and responsibility for, worldwide distribution of its proprietary Safe Delivery Source (SDS), gas storage and delivery system and related technologies from Matheson Tri-Gas.

10/28/2011 

Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.

10/28/2011 

ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.

10/27/2011 

Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.

10/27/2011 

EV Group (EVG) launched a suite of temporary bonding and debonding equipment modules that support ZoneBOND technology.

10/20/2011 

Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.

10/19/2011 

Mattson Technology Inc. (NASDAQ: MTSN) won acceptance for its Helios XP rapid thermal processing (RTP) system for process of record from a major Asian foundry.

10/19/2011 

NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.