Packaging

PACKAGING ARTICLES


ULIS invests EUR20M in advanced IR imaging sensor fab and packaging

07/10/2012 

ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.
Ultratech named advanced packaging tool supplier of choice by top-tier packaging houses

07/10/2012 

Ultratech formed 'exclusive supplier' and 'preferred tool vendor' agreements with several top-tier advanced packaging companies around the world.
STATS ChipPAC ramps advanced flip chips to HVM, adds TCB processing capability

07/10/2012 

STATS ChipPAC brought its fcCuBE advanced flip chip semiconductor packaging technology with copper column bumps, bond-on-lead interconnection, and enhanced assembly processes into high-volume manufacturing for multiple customers.
2.5/3D interposers fabbed at 30% lower COO with USHIO

07/09/2012 

USHIO Inc. is introducing the large-field stepper lithography tool

Multitest releases 3D packaging test combination for sensitive bare die

07/09/2012 

Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.
More SEMICON West exhibit previews

07/08/2012 

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
Top conference reports from H1 2012

07/06/2012 

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
Xilinx boosts silicon and electronics engineering in Ireland

07/05/2012 

Xilinx will invest $50 million to expand its electronics engineering operations, located at the company
EVG temporary wafer bonding platform doubles throughput for 3D packaging

07/04/2012 

EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.
MLCC manufacturers order ESI high-throughput test system

07/03/2012 

Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.
Epson launches high-throughput IC test handler for volume test

07/02/2012 

Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.
Tessera: Adding Vista Point Technologies, losing Powertech Technology?

07/02/2012 

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.
Unisem focuses new business model on Tier-1 customers and high-value technologies

06/29/2012 

UNISEM relaunched its business model with the name

Ultratech acquires IBM patents for semiconductor packaging processes

06/29/2012 

Ultratech acquired IBM patents on semiconductor packaging technologies, including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging.
3D and 2.5D Integration: A Status Report Live Event

06/28/2012 

This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.
SEMICON West preview: Metrology, inspection, and process control products

06/28/2012 

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
2012 “Best of West” award finalists announced

06/28/2012 

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
3D and 2.5D Integration: A Status Report preview with TechSearch International

06/26/2012 

Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at

Xilinx speaker joins 3D packaging webcast roster

06/26/2012 

Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.
JPSA picosecond laser micromachining platform reduces debris and thermal damage

06/26/2012 

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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