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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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LORD Corporation launched the ME-555 underfill encapsulant for semiconductor packaging and assembly. LORD ME-555 is a high-purity, semiconductor-grade epoxy underfill for encapsulating flip chips.
JaroThermal's Honeycomb heatsink directs heat towards the outside of the device, while producing a steady flow of cool air inside the heatsink. Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages.
Carsem will grow its Suzhou, China factory by an additional 430,000 square feet, increasing their Suzhou micro leadframe package (MLP) capacity to over 20 million per day, with a focus on copper wire bonding.
Agilent Technologies Inc. (NYSE:A) released the B2900A Series line of compact benchtop source/measure units (SMU) for semiconductor, component, and materials testing. The company claims that these SMUs offer capabilities competitive with semiconductor device analyzers.