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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Zvi Or-Bach, MonolithIC 3D, describes the TSV-beating monolithic IC fab process, and argues for scaling "up" rather than down. Or-Bach compares the costs of further semiconductor scaling to advanced packaging.
Defect source analysis (DSA) and spatial signature analysis (SSA) go beyond process control to determine where in the process defects are introduced, which defects are common from one process step to the next, how defects propagate throughout the production line, and defect signatures and causes. John Robinson, KLA-Tencor, offers examples of defects and how these can be missed or mis-identified, wasting wafers and time.
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.
Sonix Inc., scanning acoustic microscope designer and manufacturer, introduced its Stacked Die Imaging (SDI) enhancement, which effectively inspects for defects in semiconductor stacked die and wafer level packages (WLP) by selectively increasing the ultrasonic signal gain for deeper interfaces of interest.
András Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.
Reticle Labs released RS-Mini, an enterprise-class highly compact mask inspection defect management framework for mask and wafer fabrication plant infrastructure. It allows fabs to share inspection results, track defect trends, summarize inspection results from multiple systems, and more.
Applied Materials Inc. (AMAT) debuted the Applied DFinder darkfield inspection system, which uses deep ultraviolet (DUV) laser scanning for particle sensitivity down to 40nm on patterned wafers. The product suits inspecting the interconnect layers in 22nm and below memory and logic chips.
Novellus Systems (NASDAQ: NVLS) debuted the VECTOR Excel for pre- and/or post-processing of dielectric films, such as diffusion barriers. New interface engineering reduces the RC delay constant without incorporating new materials into the back-end-of line (BEOL) integration scheme. 
An earthquake of magnitude 8.9 struck March 11 off the coast of Japan's main island, Honshu. Jim Handy, Objective Analysis semiconductor market research, and other analysts share insights into Japan's semiconductor fabs and the quake's impact range. The update includes information from individual semiconductor companies in the area.
Among the topics covered at KLA-Tencor’s annual Lithography Users Forum was extension of KLAC's Teron 600 platform for inspection of EUV blanks at the 16nm hp node. Here, Brian Trafas speaks with Debra Vogler about process control in advanced lithography.