Category Archives: Semicon West

Fremont, CA, July 17, 2002 – ChipPAC, Inc. (Nasdaq: CHPC), one of the world’s largest and most diversified providers of semiconductor assembly and test services, today announced that it has successfully engineered a high performance embedded processor module, named the i-Module, with 5 chips in the footprint of a standard Ball Grid Array (BGA) package. The module combines an embedded processor assembled on the bottom side of the package using advanced flip chip technology, with high speed memory chips, multiple passives and a heat spreader assembled on the top side. ChipPAC designed and simulated the total package electrical, thermal and mechanical reliability using its proprietary SmartDESIGNTM process to ensure first time success with predictable performance.

Manufacturing Execution Systems (MES) Interface and Implemented “Embedded” Capability Enables New Level of Equipment Control

SEMICON West, San Jose, Calif., July 17, 2002 – KINESYS Software, Inc., a leading provider of software for the automation of semiconductor manufacturing processes, today announced that ALPS (Assembly Line Production Supervisor) 2.6 is available for immediate shipment.

First introduced in 1995, ALPS is the industry’s leading software for wafer map data management and equipment integration in the inkless assembly of semiconductors. ALPS 2.6 is being displayed at the opening portion of SEMICON West devoted to the “back end” of the semiconductor manufacturing process by a KINESYS partner — Universal Instruments Corporation. It can be seen at the Universal booth (#11627) in McEnery Hall at the San Jose Convention Center July 17-19.

SEMICON WEST, SAN JOSE, Calif., July 17 /PRNewswire-FirstCall/ –Advantest Corporation (NYSE: ATE, TSE 6857) today announced its plans to establish the Semiconductor Test Consortium — the first industry-wide collaboration aimed at solving the challenges of cost-effectively testing complex logic devices, such as systems-on-chip (SoCs). This nonprofit consortium is expected to focus on supporting the development of the Semiconductor Test Open Architecture, a new framework created to enable open test solutions that offer true hardware and software interoperability, with unparalleled technical and economic benefits.

SEMICON West, SAN JOSE, Calif. – July 17, 2002 – Tessera Technologies, a premier developer of intellectual property and services for chip-scale and multi-chip packages (CSPs and MCPs), today announced that Taiwan’s Walton Advanced Electronics has signed a Tessera Compliant Chip license that will enable Walton to build advanced packages for high-performing DRAM chips used in gaming consoles, corporate servers and other performance-intensive computing products.

SEMICON West, SAN JOSE, Calif. – July 17, 2002 – Tessera Technologies, a premier developer of intellectual property and services for chip-scale and multi-chip packages, today announced the newest addition to Tessera’s µZ(tm) technology family, the µZ-Ball Stacked multi-chip memory package. Original equipment manufacturers (OEMs) and memory module manufacturers can now stack up to four DRAM chips into a single multi-chip package. The result is a sizeable increase in memory capacity-nearly eight times that provided by alternative technologies currently available, such as thin small-outline packages (TSOP).

Cham/Switzerland, July 17, 2002 – ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC’s customers and will insure more accurate bonding performance and overall superior results.

ESEC’s newly developed bondhead technology is based on a system that employs rotation, thereby enabling a significant increase in speed to be achieved. ESEC’s strong financial position and strategic commitment to interconnect assembly solutions has enabled it to sustain investments in research and development. Thanks to these efforts, it was also possible to increase bonding speed without a commensurate increase in motor power and not at the cost of the bonding accuracy that is so crucial in bonding. Although the new bondhead is only at the dawn of its development, a direct comparison with conventional technologies has already revealed outstanding results, both in terms of productivity and accuracy at speed. ESEC’s new innovative solution makes it possible for significantly more than 20 gold or copper wires to be bonded every second, and this with an equal or even greater degree of precision. At present, conventional machines bond up to a maximum of 16 – 18 wires per second.

CHANDLER, Ariz. and RESEARCH TRIANGLE PARK, N.C., July 18, 2002 — Amkor Technology, Inc. (Nasdaq: AMKR) and Unitive, Inc. have expanded their two-year relationship by entering into a strategic manufacturing alliance to collaborate on turn-key manufacturing services using Unitive’s wafer level packaging solutions and Amkor’s advanced ackaging and test capabilities.

SAN FRANCISCO, SEMICON West, July 22, 2002 — Agilent Technologies Inc. (NYSE: A) today announced a new cost-saving parametric test platform, developed in cooperation with ACCRETECH and Cascade Microtech Inc. The Agilent 4070 DC/RF parametric test solution is a complete, integrated test solution for direct current (DC) and radio frequency (RF) testing of RF-CMOS devices used in wireless, consumer electronics, high-speed Internet and other applications.

Award Recognizes Ultratech’s Commitment to Employee Health and Safety; Ranks Among the Lowest Workers’ Compensation Claims in Electronics Industry

SAN JOSE, Calif., SEMICON West 2002, July 16 /PRNewswire-FirstCall/ —
Ultratech Stepper, Inc. (Nasdaq: UTEK), a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, today launched a new line of steppers specifically targeted toward the core process requirements being driven by the transition to nanotechnology. Ultratech’s new NanoTech(TM) stepper family comprises five products, each based on one of Ultratech’s existing lithography systems, with features designed to address key challenges associated with handling and processing materials used in a variety of nanotechnology applications. Beta testing of the NanoTech family is scheduled to begin in the Q4 2002 timeframe, with production versions available by January 2003.

SEMICON WEST, SAN FRANCISCO, July 23 /PRNewswire-FirstCall/ — Ultratech Stepper, Inc. (Nasdaq: UTEK), a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, today announced that its chairman and CEO, Arthur W. Zafiropoulo, has been elected by the membership of Semiconductor Equipment and Materials International (SEMI) as chairman of the industry association’s board of directors for 2002.

(June 25, 2002) San Francisco — Held here July 22 through 24, 2002, at the Moscone Center, SEMICON West (Wafer Processing) is packed with courses, classes and networking opportunities. Advanced Packaging Online is pleased to bring you the SEMICON West program. Come visit us at Booth 5953 in San Francisco. (For more information on SEMICON West, visit www.semi.org).

(June 24, 2002) San Jose, Calif. — Held here July 17 through 19, 2002, at the San Jose Convention Center, SEMICON West (Final Manufacturing) is packed with courses, classes and networking opportunities. Advanced Packaging Online is pleased to bring you the SEMICON West program. Come visit us at Booth 11407 in San Jose, and look for information on SEMICON West San Francisco tomorrow.

Relocation


September 1, 2001
Click here to enlarge image

Moving from California to New Hampshire has been an educational experience. The move, prompted recently by the opportunity to join the Advanced Packaging staff, gave me the chance to learn, among other things, that our family's possessions weigh 9.7 tons. The movers felt free to remind us of that repeatedly on two very long days this summer. I also learned what an “acre” is – a term that certainly doesn't enter the vocabularies of mere mortals in the California real estate market.

On the professional side, I found it difficult to move away from Silicon Valley while our editor in the area gets all of the best stories, fearing that I would lose touch with the center of the industry. I was looking forward, though, to learning more about some of the companies on the East Coast. The eye-opening part, now that I am here, is seeing how many there really are! My personal and professional relocation has been a good reminder that there is more to the industry than what can be found in Santa Clara County. My list of companies to visit in the Northeast has gone way beyond the few that I expected to see.

This lesson might be a useful one for SEMICON West, as well. It is a tremendous event, of course, and while there might be better ways to learn the details of the latest equipment and technologies, there is certainly no better way to meet a bunch of key contacts all at once and to get a gut feel for what is going on the industry. (See our report on p. 14 for what the collective AP gut felt.) Clearly, the event has been very well orchestrated between two cities.

However, there is still ongoing debate about what to do now that SEMICON West has outgrown its twin venues in the San Francisco Bay area. There is much understandable reluctance to do any of the overhauls that would solve the crowding, with the options including a limit on the participation, another split or a move to a city with large enough facilities.

Many think that moving SEMICON West out of Silicon Valley would, literally and figuratively, spoil the party. It would certainly require some big changes in how exhibitors and attendees approach it, but what's wrong with some big changes? Benefits that I can envision include a more focused audience if a greater fraction of the attendees have traveled away from their jobs. (How many people who work in the Valley feel like they can spend the whole week at the show?) A less Valley-centric event might also call more attention to what goes on elsewhere in the industry. Think of it as an industry “off-site” with all of the intangibles associated with a change in venue.

Other specific effects of a relocated SEMICON West can also be debated, but I am generally in favor of big changes for the benefits that you can't predict. SEMICON West might serve its purpose even better – or even fill a new role that we can't envision now – if it were moved. Let's hope that the decision-makers continue to keep an open mind about the options and don't rule out shaking things up a bit. My family (and employer) certainly kept an open mind when considering the option of moving six people (including a one month old baby!), a Malamute sled dog and that 9.7-ton load across the country.

AP

Thanks for reading,
Jeffrey C. Demmin
Editor-in-Chief
[email protected]