11/04/2011  Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.

11/02/2011 

Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.

11/02/2011 

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.

11/01/2011 

Invensas has "acquired" dozens of 3D IC packaging patents from Allvia, and the two have agreed to further collaboration in the area.

11/01/2011 

2.5D, 3D and Beyond - Bringing 3D Integration to the Packaging Mainstream will take place November 9 in Santa Clara, CA. The MEPTEC conference follows the trend of 3D and 2.5D packaging moving from roadmap to factory production.

10/25/2011 

Xilinx Inc. (Nasdaq:XLNX) began shipping its Virtex-7 2000T field programmable gate array (FPGA), a programmable logic device with 6.8 billion transistors: 2 million logic cells, a die-stack architecture, low power consumption, and a more flexible design than large ASICS and monolithic FPGAs.

10/24/2011 

The 2012 Symposia on VLSI Technology & Circuits, to be held in Hawaii, June 12-14 (Technology) and 13-15 (Circuits), will accept innovative, original work on microelectronics, ranging from gate stacks and advanced lithography to 3D packaging.

10/19/2011 

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.

10/18/2011 

SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool clusters to a leading IDM.

10/11/2011 

EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600

10/11/2011 

STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.

10/11/2011 

All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10

10/06/2011 

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

10/04/2011 

Bryan Rice, SEMATECH's newly appointed director of strategic initiatives, tells SST what his new job entails: what he sees as his biggest challenges, which areas will keep SEMATECH's main attention (hint: the "once and future king" of resources), and what new areas are being explored.

10/03/2011 

Rudolph Technologies Inc. (NASDAQ:RTEC) shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures.

09/29/2011 

Samsung Electronics Co. Ltd. developed a high-performance 64GB embedded memory with 64Gb NAND. The package contains an 8 die stack in a low profile for smartphones, tablets and other mobile devices.

09/20/2011 

The first annual Global Interposer Technology Workshop at Georgia Tech will convene students, academics, researchers, and industry to share information on silicon and glass interposers for semiconductor packaging.

09/19/2011 

Dr. Phil Garrou takes a closer look at highlights from a SiP summit at the recent SEMICON Taiwan: Xilinx FPGAs and Elpida's low-power DDR3 memory.

09/16/2011 

The Burn-in & Test Socket Workshop (BiTS Workshop) is changing its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs."

09/08/2011 

Invensas Corporation, a Tessera subsidiary, will demonstrate dual-face down implementation of its new multi-die face-down packaging technology at the Intel Developer's Forum. The multi-die package is wire bonded, mounting ICs upside down and staggering them in a shingle-like configuration.