Yole Developpment recently gave a webinar based on their fall 2012 report on the CMOS Image Sensor Market. For those of you who didn’t attend it, lets look at some of the interesting facts that they presented.
The CIS module value chain can be broken out into segments consisting of front end chip fab, optical layers, back end / packaging and module assembly and test. The figure below shows their estimated market values in 2012.
The market is seen evolving…
Revenue by application is shown in the figure below. By 2016, revenue should exceed $10B with mobile handsets and consumer applications, such as accounting for most of that revenue.

In 2011 OmniVision, Samsung and Sony were responsible for 50% of the $5.8B market. Taiwan, Korea and Japan accounting for 80% of the total market.

The low end market segments include cell phones, toys and bar code readers. The evolving high end market segments include medical, DSLR cameras, automotive, machine vision, surveillance etc.
BSI technology will have taken 50% of the overall market by 2015.
The next generation technology will be 3D stacking which is already being introduced by Sony [ see IFTLE 112 "TSMC Staffing up or 2.5/3D expansion; Semi 3D Standards; Sony Shows off 3D Stacked Image Sensors"]
For all the latest in 3DIC and advanced packaging, stay linked to IFTLE.
