By Dr. Phil Garrou, Contributing Editor
System Integration by 3D SiP
The forum chairman was CP Hung, who is currently the VP of Corporate R&D for ASE Group, responsible for next generation products development. The System Integration by 3D SiP forum invited global experts to discuss the development of 3DIC and 2.5DIC packaging and alternative solutions. Presentations were made by Cisco, AMD, SK Hynix, ASE, Altera, Amkor, Teledyne and Cadence.
AMD
Bryan Black detailed the commercialization of the AMD “Fiji” GPU which has been in development for 8.5 years. It “required the collaboration of 20+ companies and government research organizations”. The four that were key included Amkor, ASE, SK Hynix and UMC.
Some of the obstacles that they ran up against are listed below:
SK Hynix is in production with HBM memory in support of “Fiji”. HBM benefits include:
- 4096-bit memory interface with four stacks creating 512GB/s of bandwidth
- 60% higher memory bandwidth6 for 60% less power7 than GDDR5
- 4X bandwidth per watt improvement from Radeon (TM) R9 290X
SK Hynix
Hongshin Jun of SK Hynix detailed their high bandwidth memory development. Each application has different memory requirements, but most common are high bandwidth (HBM) and low power consumption.
Mass production of their HBMPower consumption and bandwidth are compared for DDR and HBM below:
HBM 2 will show the following properties:
The stacked memory features 25um bumps on 55um pitch.
Amkor
Min Yoo of Amkor presented their SLIM and SWIFT package architectures. Basically, these are interconnected first technologies with no TSV. SLIM uses back-end foundry technology for <2um L/S, whereas SWIFT uses 2-10um OSAT RDL technology.
GaTech Global Interposer Workshop coming in November
The fifth annual GaTech Interposer workshop is coming Nov 4-6. With 2.5 and 3D being buzzwords, many conferences have interposer presentations. But the GaTech conference does the best job of bringing together practitioners from silicon, laminate and glass segments of this leading edge technology. This year’s conference is led by Rao Tummala (the Godfather of packaging) and Matt Nowak of Qualcomm, and Subu Iyer, who recently retired from IBM to teach at UCLA.
Highlight presentations include:
- Bob Sankman (Intel) – EMIB packaging
- Dave McCann (Global Foundries) – ASIC and RF with 2.5D technology
- Doug Yu (TSMC) – InFO
- Suresh Ramalingam (Xilinx) – SLIT (a TSV-less interconnect technology)
- Ron Huemoeller(Amkor) – Advance fan out: SWIFT and SLIM
- Bryan Black (AMD) – The road to AMD’s Fuji dGPU Chip
- DC Hu (Unimicron) – Glass manufacturing readiness
- Tomoyuki Yamada (Kyocera) – Organic interposers
Hope to see you all in Atlanta!
For all the latest on 2.5/3D and other advanced packaging stay linked to IFTLE.
